Wei-Yin SHIAO

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a via profile of interconnect structure of semic...
- Patent number 9,997,401
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yin Shiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning via of interconnect structure of semiconductor...
- Patent number 9,761,488
- Issue date Sep 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Shin Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming via profile of interconnect structure of semicon...
- Patent number 9,536,964
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yin Shiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure
- Patent number 9,425,087
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming a Via Profile of Interconnect Structure of Semic...
- Publication number 20170194197
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yin Shiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING VIA OF INTERCONNECT STRUCTURE OF SEMICONDUCTOR...
- Publication number 20170018458
- Publication date Jan 19, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-Shin CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING VIA PROFILE OF INTERCONNECT STRUCTURE OF SEMICON...
- Publication number 20160351669
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Yin SHIAO
- H01 - BASIC ELECTRIC ELEMENTS