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last 30 patents
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Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
Publication number
20240145457
Publication date
May 2, 2024
Micron Technology, Inc.
Faxing CHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
Publication number
20240071881
Publication date
Feb 29, 2024
Micron Technology, Inc.
Ling Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE SPACER
Publication number
20240047285
Publication date
Feb 8, 2024
Micron Technology, Inc.
Faxing Che
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION DESIGNS FOR MEMORY SYSTEMS
Publication number
20240039185
Publication date
Feb 1, 2024
Micron Technology, Inc.
Wei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...
Publication number
20230207488
Publication date
Jun 29, 2023
Micron Technology, Inc.
Faxing Che
H01 - BASIC ELECTRIC ELEMENTS