Wei Yu

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
- Patent number 12,368,113
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexible spacer including a support stru...
- Patent number 12,362,247
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection designs for memory systems
- Patent number 12,355,167
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
- Publication number 20240145457
- Publication date May 2, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240071881
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE SPACER
- Publication number 20240047285
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DESIGNS FOR MEMORY SYSTEMS
- Publication number 20240039185
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...
- Publication number 20230207488
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS