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Patents Grants
last 30 patents
Information
Patent Grant
Polyimide-carbon nanotube composite film
Patent number
10,011,694
Issue date
Jul 3, 2018
Nanyang Technological University
Bee Eng Mary Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming polyimide-carbon nanotube composite film, and p...
Patent number
9,576,698
Issue date
Feb 21, 2017
Nanyang Technological University
Bee Eng Mary Chan
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Methods for dispersing carbon nanotubes and compositions used for t...
Patent number
9,169,394
Issue date
Oct 27, 2015
Nanyang Technological University
Bee Eng Mary Chan
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Interposer for semiconductor package
Patent number
8,772,921
Issue date
Jul 8, 2014
United Test & Assembly Center Ltd.
Chin Hock Toh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interposer for semiconductor package
Patent number
8,115,292
Issue date
Feb 14, 2012
United Test & Assembly Center Ltd.
Chin Hock Toh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
POLYIMIDE-CARBON NANOTUBE COMPOSITE FILM
Publication number
20170145175
Publication date
May 25, 2017
Nanyang Technological University
Bee Eng Mary Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING POLYIMIDE-CARBON NANOTUBE COMPOSITE FILM, AND P...
Publication number
20130075671
Publication date
Mar 28, 2013
Nanyang Technological University
Bee Eng Mary Chan
B82 - NANO-TECHNOLOGY
Information
Patent Application
METHODS FOR DISPERSING CARBON NANOTUBES AND COMPOSITIONS USED FOR T...
Publication number
20130035419
Publication date
Feb 7, 2013
Nanyang Technological University
Bee Eng Mary Chan
B82 - NANO-TECHNOLOGY
Information
Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
Publication number
20120104628
Publication date
May 3, 2012
United Test & Assembly Center Ltd.
Chin Hock Toh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERPOSER FOR SEMICONDUCTOR PACKAGE
Publication number
20100109142
Publication date
May 6, 2010
United Test & Assembly Center Ltd.
Chin Hock Toh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR