Wei ZHENG

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Guangzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Filter radio frequency module packaging structure and method for ma...
- Patent number 12,184,253
- Issue date Dec 31, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang Yan
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20240283132
- Publication date Aug 22, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240234328
- Publication date Jul 11, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153913
- Publication date May 9, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240136297
- Publication date Apr 25, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...
- Publication number 20240007072
- Publication date Jan 4, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yingqiang YAN
- H03 - BASIC ELECTRONIC CIRCUITRY