Wei Zheng

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St. Paul, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Fluidic heterogeneous microsystems assembly and packaging
- Patent number 7,625,780
- Issue date Dec 1, 2009
- Regents of The University of Minnesota
- Heiko O. Jacobs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fluidic heterogeneous microsystems assembly and packaging
- Publication number 20060223205
- Publication date Oct 5, 2006
- Heiko O. Jacobs
- H01 - BASIC ELECTRIC ELEMENTS