Wei Zou

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,531,025
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Patterned metal thermal interface
- Patent number 8,156,998
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,021,925
- Issue date Sep 20, 2011
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and methods of processing for solder thermal interface ma...
- Patent number 7,898,076
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Bruce Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metal thermal interface
- Patent number 7,694,719
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Micro-bumps to enhance LGA interconnections
- Patent number 7,302,757
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 7,268,428
- Issue date Sep 11, 2007
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having chip extension and method
- Patent number 7,250,576
- Issue date Jul 31, 2007
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED METAL THERMAL INTERFACE
- Publication number 20100147497
- Publication date Jun 17, 2010
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20080299707
- Publication date Dec 4, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Methods of Processing for Solder Thermal Interface Ma...
- Publication number 20080265404
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Bruce Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED METAL THERMAL INTERFACE
- Publication number 20080165502
- Publication date Jul 10, 2008
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20070222064
- Publication date Sep 27, 2007
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20070045819
- Publication date Mar 1, 2007
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING CHIP EXTENSION AND METHOD
- Publication number 20060261467
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-bumps to enhance LGA interconnections
- Publication number 20060030170
- Publication date Feb 9, 2006
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS
- Publication number 20050221635
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Thermal paste containment for semiconductor modules

Patterned metal thermal interface

Thermal paste containment for semiconductor modules

Structure and methods of processing for solder thermal interface ma...

Patterned metal thermal interface

Micro-bumps to enhance LGA interconnections

Thermal paste containment for semiconductor modules

Chip package having chip extension and method

Patents Applicationslast 30 patents

PATTERNED METAL THERMAL INTERFACE

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

Structure and Methods of Processing for Solder Thermal Interface Ma...

PATTERNED METAL THERMAL INTERFACE

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

CHIP PACKAGE HAVING CHIP EXTENSION AND METHOD

Micro-bumps to enhance LGA interconnections

MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS