Weifeng Liu

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic encapsulation through stencil printing
- Patent number 12,156,356
- Issue date Nov 26, 2024
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Testing system for flexible sample in electronics having a retracta...
- Patent number 11,493,414
- Issue date Nov 8, 2022
- Flex Ltd.
- Weifeng Liu
- G01 - MEASURING TESTING
Information Patent Grant
Stress relief encapsulation for flexible hybrid electronics
- Patent number 11,470,717
- Issue date Oct 11, 2022
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, devices, and systems for electronic device molding and enc...
- Patent number 11,289,393
- Issue date Mar 29, 2022
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronics encapsulation through hotmelt lamination
- Patent number 11,064,613
- Issue date Jul 13, 2021
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of integrating an electronic module with conductive fabric
- Patent number 11,051,401
- Issue date Jun 29, 2021
- Flextronics AP, LLC
- Weifeng Liu
- D03 - WEAVING
Information Patent Grant
System and method for in-molded electronic unit using stretchable s...
- Patent number 11,039,531
- Issue date Jun 15, 2021
- Flex Ltd.
- Jesus Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating biosensor to compression shirt textile and interconnect...
- Patent number 10,993,635
- Issue date May 4, 2021
- Flextronics AP, LLC
- William Uy
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Stress relief encapsulation for flexible hybrid electronics
- Patent number 10,999,926
- Issue date May 4, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor array and the method of making
- Patent number 10,690,559
- Issue date Jun 23, 2020
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric with woven wire braid
- Patent number 10,687,421
- Issue date Jun 16, 2020
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection of multilayer printed conductive ink through filled micr...
- Patent number 10,653,010
- Issue date May 12, 2020
- Flex Ltd.
- Weifeng Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component attach on metal woven mesh
- Patent number 10,645,807
- Issue date May 5, 2020
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroluminescent display on smart textile and interconnect methods
- Patent number 10,575,381
- Issue date Feb 25, 2020
- Flex Ltd.
- William Uy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible and stretchable chain battery
- Patent number 10,535,845
- Issue date Jan 14, 2020
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printing with components embedded
- Patent number 10,375,834
- Issue date Aug 6, 2019
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable printed electronic sheets to electrically connect uneve...
- Patent number 10,244,623
- Issue date Mar 26, 2019
- Flextronics AP, LLC
- Anwar Mohammed
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Copper interconnect for PTH components assembly
- Patent number 10,231,333
- Issue date Mar 12, 2019
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated system of an electronic module and conductive fabric and...
- Patent number 10,201,080
- Issue date Feb 5, 2019
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable printed battery and methods of making
- Patent number 10,003,087
- Issue date Jun 19, 2018
- Flextronics AP, LLC
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of sewing components in fabrics using metal wire cloth
- Patent number 9,872,383
- Issue date Jan 16, 2018
- Flextronics AP, LLC
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of interconnecting components on fabrics using metal braids
- Patent number 9,839,125
- Issue date Dec 5, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bellows interconnect
- Patent number 9,801,277
- Issue date Oct 24, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of attaching components on fabrics using metal braids
- Patent number 9,763,326
- Issue date Sep 12, 2017
- Flextronics AP, LLC
- Weifeng Liu
- A41 - WEARING APPAREL
Information Patent Grant
Magnet wire for 3D electronic circuitry
- Patent number 9,736,932
- Issue date Aug 15, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board made through sintering copper nano-particles
- Patent number 9,699,902
- Issue date Jul 4, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making RFID antenna by placing wire on fabric
- Patent number 9,684,864
- Issue date Jun 20, 2017
- Flextronics AP, LLC
- Weifeng Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making copper pillar with solder cap
- Patent number 9,674,952
- Issue date Jun 6, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making stretchable interconnect using magnet wires
- Patent number 9,674,949
- Issue date Jun 6, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of stitching components on fabrics using metal foils
- Patent number 9,674,950
- Issue date Jun 6, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD
- Publication number 20220173066
- Publication date Jun 2, 2022
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS BENDING FIXTURE DESIGN
- Publication number 20220018746
- Publication date Jan 20, 2022
- Flex Ltd.
- Weifeng Liu
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING
- Publication number 20210321524
- Publication date Oct 14, 2021
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...
- Publication number 20210193543
- Publication date Jun 24, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS
- Publication number 20210176857
- Publication date Jun 10, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ELECTRONIC COMPONENTS TO PRINTED CONDUCTIVE INK
- Publication number 20210076496
- Publication date Mar 11, 2021
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS
- Publication number 20200404780
- Publication date Dec 24, 2020
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION
- Publication number 20200344891
- Publication date Oct 29, 2020
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND...
- Publication number 20190098753
- Publication date Mar 28, 2019
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVE...
- Publication number 20160309584
- Publication date Oct 20, 2016
- FLEXTRONICS AP, LLC
- Anwar Mohammed
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND...
- Publication number 20160183367
- Publication date Jun 23, 2016
- FLEXTRONICS AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVE...
- Publication number 20160157363
- Publication date Jun 2, 2016
- FLEXTRONICS AP, LLC
- Anwar Mohammed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Devices and Methods for 2.5D Interposers
- Publication number 20140070406
- Publication date Mar 13, 2014
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS

Weifeng Liu

Person

Patents Grantslast 30 patents

Electronic encapsulation through stencil printing

Testing system for flexible sample in electronics having a retracta...

Stress relief encapsulation for flexible hybrid electronics

Methods, devices, and systems for electronic device molding and enc...

Electronics encapsulation through hotmelt lamination

Method of integrating an electronic module with conductive fabric

System and method for in-molded electronic unit using stretchable s...

Integrating biosensor to compression shirt textile and interconnect...

Stress relief encapsulation for flexible hybrid electronics

Pressure sensor array and the method of making

Fabric with woven wire braid

Connection of multilayer printed conductive ink through filled micr...

Component attach on metal woven mesh

Electroluminescent display on smart textile and interconnect methods

Flexible and stretchable chain battery

3D printing with components embedded

Stretchable printed electronic sheets to electrically connect uneve...

Copper interconnect for PTH components assembly

Integrated system of an electronic module and conductive fabric and...

Stretchable printed battery and methods of making

Methods of sewing components in fabrics using metal wire cloth

Methods of interconnecting components on fabrics using metal braids

Bellows interconnect

Methods of attaching components on fabrics using metal braids

Magnet wire for 3D electronic circuitry

Printed circuit board made through sintering copper nano-particles

Method of making RFID antenna by placing wire on fabric

Method of making copper pillar with solder cap

Method of making stretchable interconnect using magnet wires

Methods of stitching components on fabrics using metal foils

Patents Applicationslast 30 patents

FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD

ELECTRONICS BENDING FIXTURE DESIGN

ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING

METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...

STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS

SOLDER ELECTRONIC COMPONENTS TO PRINTED CONDUCTIVE INK

STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS

ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION

INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND...

STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVE...

INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND...

STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVE...

Devices and Methods for 2.5D Interposers