Weifeng Liu

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Roseville, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package with compliant electrically-conductive ball inte...
- Patent number 7,825,512
- Issue date Nov 2, 2010
- Hewlett-Packard Development Company, L.P.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Damage prevention interposer for electronic package and electronic...
- Patent number 7,742,311
- Issue date Jun 22, 2010
- Hewlett-Packard Development Company, L.P.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket having foam metal contacts
- Patent number 6,799,977
- Issue date Oct 5, 2004
- Hewlett-Packard Development Company, L.P.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Damage Prevention Interposer for Electronic Package and Electronic...
- Publication number 20080253098
- Publication date Oct 16, 2008
- Hewlett-Packard Development Company, L.P.
- Weifeng Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic package with compliant electrically-conductive ball inte...
- Publication number 20070057382
- Publication date Mar 15, 2007
- Weifeng Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Socket having foam metal contacts
- Publication number 20050042895
- Publication date Feb 24, 2005
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket having foam metal contacts
- Publication number 20040009686
- Publication date Jan 15, 2004
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS