Weifeng YE

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,707,122
- Issue date Jul 7, 2020
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce trap-induced capacitance in interconnect dielectri...
- Patent number 10,546,742
- Issue date Jan 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce trap-induced capacitance in interconnect dielectri...
- Patent number 10,170,299
- Issue date Jan 1, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,109,520
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for thermally forming a selective cobalt layer
- Patent number 10,043,709
- Issue date Aug 7, 2018
- Applied Materials, Inc.
- Hua Ai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cu/barrier interface enhancement
- Patent number 9,633,861
- Issue date Apr 25, 2017
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing electrical property and UV compatibility of ultrathin blo...
- Patent number 9,580,801
- Issue date Feb 28, 2017
- Applied Materials, Inc.
- Xiaolan Ba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt selectivity improvement in selective cobalt process sequence
- Patent number 9,478,460
- Issue date Oct 25, 2016
- APPLIED MATERIALS, INC.
- Mei-yee Shek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt selectivity improvement in selective cobalt process sequence
- Patent number 9,105,695
- Issue date Aug 11, 2015
- Applied Materials, Inc.
- Mei-yee Shek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper oxide removal techniques
- Patent number 8,758,638
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A MEOL CONTACT STRUCTURE
- Publication number 20240379768
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shumao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Selective Metal Deposition Using Separated Reactant Activ...
- Publication number 20240191354
- Publication date Jun 13, 2024
- Ying-Bing JIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for Forming Low Resistivity Contacts
- Publication number 20240105444
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Jiang LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20230377892
- Publication date Nov 23, 2023
- Yiyang WAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...
- Publication number 20190189433
- Publication date Jun 20, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20190027403
- Publication date Jan 24, 2019
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration Improvement Using Tungsten For Selective Cobalt De...
- Publication number 20180144973
- Publication date May 24, 2018
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20170098575
- Publication date Apr 6, 2017
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...
- Publication number 20170005041
- Publication date Jan 5, 2017
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE
- Publication number 20160141203
- Publication date May 19, 2016
- Applied Materials, Inc.
- MEI-YEE SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR THERMALLY FORMING A SELECTIVE COBALT LAYER
- Publication number 20160133563
- Publication date May 12, 2016
- Applied Materials, Inc.
- HUA AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING ELECTRICAL PROPERTY AND UV COMPATIBILITY OF ULTRATHIN BLO...
- Publication number 20160071724
- Publication date Mar 10, 2016
- Applied Materials, Inc.
- Xiaolan BA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCING UV COMPATIBILITY OF LOW K BARRIER FILM
- Publication number 20160013049
- Publication date Jan 14, 2016
- Applied Materials, Inc.
- Weifeng YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE
- Publication number 20140349480
- Publication date Nov 27, 2014
- Mei-yee SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VBD AND TDDB IMPROVEMENT THRU INTERFACE ENGINEERING
- Publication number 20140273516
- Publication date Sep 18, 2014
- Li-Qun XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU/BARRIER INTERFACE ENHANCEMENT
- Publication number 20140273438
- Publication date Sep 18, 2014
- Weifeng YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER OXIDE REMOVAL TECHNIQUES
- Publication number 20120289049
- Publication date Nov 15, 2012
- Applied Materials, Inc.
- WEIFENG YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...
- Publication number 20120276301
- Publication date Nov 1, 2012
- Yong-Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...
- Publication number 20090107626
- Publication date Apr 30, 2009
- APPLIED MATERIALS, INC.
- Yong-Won Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods for depositing dielectric barrier layers and aluminum conta...

Method to reduce trap-induced capacitance in interconnect dielectri...

Method to reduce trap-induced capacitance in interconnect dielectri...

Methods for depositing dielectric barrier layers and aluminum conta...

Methods for thermally forming a selective cobalt layer

Cu/barrier interface enhancement

Enhancing electrical property and UV compatibility of ultrathin blo...

Cobalt selectivity improvement in selective cobalt process sequence

Cobalt selectivity improvement in selective cobalt process sequence

Copper oxide removal techniques

Patents Applicationslast 30 patents

METHOD OF FORMING A MEOL CONTACT STRUCTURE

Method of Selective Metal Deposition Using Separated Reactant Activ...

Methods for Forming Low Resistivity Contacts

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

Electromigration Improvement Using Tungsten For Selective Cobalt De...

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...

COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE

METHODS FOR THERMALLY FORMING A SELECTIVE COBALT LAYER

ENHANCING ELECTRICAL PROPERTY AND UV COMPATIBILITY OF ULTRATHIN BLO...

ENHANCING UV COMPATIBILITY OF LOW K BARRIER FILM

COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE

VBD AND TDDB IMPROVEMENT THRU INTERFACE ENGINEERING

CU/BARRIER INTERFACE ENHANCEMENT

COPPER OXIDE REMOVAL TECHNIQUES

ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...

ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...