Weihua Cheng

Person

Hubei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 12,137,568
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices with channel structures having plu...
- Patent number 12,089,405
- Issue date Sep 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wanbo Geng
Information Patent Grant
Bonded semiconductor devices having processor and dynamic random-ac...
- Patent number 12,002,788
- Issue date Jun 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having programmable logic device and d...
- Patent number 11,996,389
- Issue date May 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices with channel s...
- Patent number 11,877,449
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wanbo Geng
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,758,732
- Issue date Sep 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified semiconductor devices having processor and heterogeneous me...
- Patent number 11,749,641
- Issue date Sep 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having programmable logic device and d...
- Patent number 11,721,668
- Issue date Aug 8, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having programmable logic device and N...
- Patent number 11,711,913
- Issue date Jul 25, 2023
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- G11 - INFORMATION STORAGE
Information Patent Grant
Unified semiconductor devices having processor and heterogeneous me...
- Patent number 11,694,993
- Issue date Jul 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded semiconductor devices having processor and dynamic random-ac...
- Patent number 11,562,985
- Issue date Jan 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,527,547
- Issue date Dec 13, 2022
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and dynamic random-ac...
- Patent number 11,430,766
- Issue date Aug 30, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,367,729
- Issue date Jun 21, 2022
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having programmable logic device and N...
- Patent number 11,302,700
- Issue date Apr 12, 2022
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,302,706
- Issue date Apr 12, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified semiconductor devices having processor and heterogeneous me...
- Patent number 11,158,604
- Issue date Oct 26, 2021
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified semiconductor devices having programmable logic device and...
- Patent number 11,024,600
- Issue date Jun 1, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 10,923,491
- Issue date Feb 16, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,818,631
- Issue date Oct 27, 2020
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 10,811,380
- Issue date Oct 20, 2020
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming channel hole in three-dimensional memory device...
- Patent number 10,790,297
- Issue date Sep 29, 2020
- Yangtze Memory Technologies Co., Ltd.
- Baoyou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 10,593,690
- Issue date Mar 17, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cooling method and method of heat dissipation
- Patent number 9,589,937
- Issue date Mar 7, 2017
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Shaoning Mei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME
- Publication number 20240172415
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin ZHU
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230363169
- Publication date Nov 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...
- Publication number 20230253364
- Publication date Aug 10, 2023
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-AC...
- Publication number 20230118453
- Publication date Apr 20, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230087468
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230005873
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220216178
- Publication date Jul 7, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION ME...
- Publication number 20220093614
- Publication date Mar 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...
- Publication number 20220028829
- Publication date Jan 27, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220020725
- Publication date Jan 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES WITH CHANNEL STRUCTURES HAVING PLU...
- Publication number 20220013536
- Publication date Jan 13, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Wanbo Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES WITH CHANNEL S...
- Publication number 20220013537
- Publication date Jan 13, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Wanbo Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210398932
- Publication date Dec 23, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210335745
- Publication date Oct 28, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND N...
- Publication number 20210305259
- Publication date Sep 30, 2021
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...
- Publication number 20210265309
- Publication date Aug 26, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND NAND FLASH MEMORY...
- Publication number 20210233916
- Publication date Jul 29, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND D...
- Publication number 20210175211
- Publication date Jun 10, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-AC...
- Publication number 20210151414
- Publication date May 20, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20210134826
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION ME...
- Publication number 20200350322
- Publication date Nov 5, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND N...
- Publication number 20200350321
- Publication date Nov 5, 2020
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED MEMORY DEVICES HAVING FLASH MEMORY CONTROLLER AND FABRICATIO...
- Publication number 20200350286
- Publication date Nov 5, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Weihua Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND NAND FLASH MEMORY...
- Publication number 20200350320
- Publication date Nov 5, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-AC...
- Publication number 20200328188
- Publication date Oct 15, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND D...
- Publication number 20200328190
- Publication date Oct 15, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...
- Publication number 20200328180
- Publication date Oct 15, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND...
- Publication number 20200328181
- Publication date Oct 15, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200295025
- Publication date Sep 17, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS

Weihua Cheng

Person

Patents Grantslast 30 patents

Hybrid bonding contact structure of three-dimensional memory device

Three-dimensional memory devices with channel structures having plu...

Bonded semiconductor devices having processor and dynamic random-ac...

Bonded semiconductor devices having programmable logic device and d...

Methods for forming three-dimensional memory devices with channel s...

Bonded semiconductor devices having processor and NAND flash memory...

Hybrid bonding contact structure of three-dimensional memory device

Unified semiconductor devices having processor and heterogeneous me...

Bonded semiconductor devices having programmable logic device and d...

Bonded semiconductor devices having programmable logic device and N...

Unified semiconductor devices having processor and heterogeneous me...

Bonded unified semiconductor chips and fabrication and operation me...

Bonded semiconductor devices having processor and dynamic random-ac...

Hybrid bonding contact structure of three-dimensional memory device

Bonded semiconductor devices having processor and dynamic random-ac...

Bonded semiconductor devices having processor and NAND flash memory...

Bonded semiconductor devices having programmable logic device and N...

Bonded unified semiconductor chips and fabrication and operation me...

Unified semiconductor devices having processor and heterogeneous me...

Unified semiconductor devices having programmable logic device and...

Hybrid bonding contact structure of three-dimensional memory device

Semiconductor structure and method of forming the same

Semiconductor structure and forming method thereof

Method for forming channel hole in three-dimensional memory device...

Hybrid bonding contact structure of three-dimensional memory device

Semiconductor cooling method and method of heat dissipation

Patents Applicationslast 30 patents

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-AC...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION ME...

UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

THREE-DIMENSIONAL MEMORY DEVICES WITH CHANNEL STRUCTURES HAVING PLU...

METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES WITH CHANNEL S...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND N...

UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND NAND FLASH MEMORY...

BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND D...

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-AC...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION ME...

BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND N...

BONDED MEMORY DEVICES HAVING FLASH MEMORY CONTROLLER AND FABRICATIO...

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND NAND FLASH MEMORY...

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-AC...

BONDED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND D...

UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS ME...

UNIFIED SEMICONDUCTOR DEVICES HAVING PROGRAMMABLE LOGIC DEVICE AND...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE