Weihua Tang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid backside thermal structures for enhanced IC packages
- Patent number 11,948,906
- Issue date Apr 2, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,756,860
- Issue date Sep 12, 2023
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture including thermoelectric cooler structures
- Patent number 11,756,856
- Issue date Sep 12, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric coolers combined with phase-change material in integ...
- Patent number 11,676,883
- Issue date Jun 13, 2023
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change materials for electromagnetic interference shielding a...
- Patent number 11,664,294
- Issue date May 30, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,626,395
- Issue date Apr 11, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with multiple channels for multichip packages
- Patent number 11,444,003
- Issue date Sep 13, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,127,727
- Issue date Sep 21, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid solder and filled paste in microelectronic packaging
- Patent number 8,920,934
- Issue date Dec 30, 2014
- Intel Corporation
- Hongjin Jiang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20240234245
- Publication date Jul 11, 2024
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20240203926
- Publication date Jun 20, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20230140685
- Publication date May 4, 2023
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20220384306
- Publication date Dec 1, 2022
- Intel Corporation
- Weihua Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20210398966
- Publication date Dec 23, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...
- Publication number 20210391244
- Publication date Dec 16, 2021
- Intel Corporation
- Chandra Mohan JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20210249375
- Publication date Aug 12, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20200388603
- Publication date Dec 10, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...
- Publication number 20200294884
- Publication date Sep 17, 2020
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
- Publication number 20200273772
- Publication date Aug 27, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...
- Publication number 20200219789
- Publication date Jul 9, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIALS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING A...
- Publication number 20200219790
- Publication date Jul 9, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION
- Publication number 20200111720
- Publication date Apr 9, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE INCLUDING THERMOELECTRIC COOLER STRUCTURES
- Publication number 20200105639
- Publication date Apr 2, 2020
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES
- Publication number 20200105643
- Publication date Apr 2, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES
- Publication number 20200098666
- Publication date Mar 26, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID FLOW IN A TEMPERATURE CONTROL ACTUATOR FOR SEMICONDUCTOR DEVI...
- Publication number 20160377658
- Publication date Dec 29, 2016
- Intel Corporation
- Paul J. DIGLIO
- G01 - MEASURING TESTING
Information Patent Application
NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...
- Publication number 20150060527
- Publication date Mar 5, 2015
- Weihua Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS
- Publication number 20150001736
- Publication date Jan 1, 2015
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
- Publication number 20140291843
- Publication date Oct 2, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Weihua Tang

Person

Patents Grantslast 30 patents

Thermally enhanced silicon back end layers for improved thermal per...

Semiconductor device stack-up with bulk substrate material to mitig...

Hybrid backside thermal structures for enhanced IC packages

Semiconductor device stack-up with bulk substrate material to mitig...

Package architecture including thermoelectric cooler structures

Thermoelectric coolers combined with phase-change material in integ...

Phase change materials for electromagnetic interference shielding a...

Thermal spreading management of 3D stacked integrated circuits

Coupled cooling fins in ultra-small systems

Integrated heat spreader with multiple channels for multichip packages

Sloped metal features for cooling hotspots in stacked-die packages

Thermal spreading management of 3D stacked integrated circuits

Hybrid solder and filled paste in microelectronic packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

THERMAL INTERFACE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

THERMALLY ENHANCED SILICON BACK END LAYERS FOR IMPROVED THERMAL PER...

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...

COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...

PHASE CHANGE MATERIALS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING A...

DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION

PACKAGE ARCHITECTURE INCLUDING THERMOELECTRIC COOLER STRUCTURES

INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES

SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES

FLUID FLOW IN A TEMPERATURE CONTROL ACTUATOR FOR SEMICONDUCTOR DEVI...

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...

DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS

HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING