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Patents Grantslast 30 patents

Information Patent Grant
PCB-pinout based packaged module and method for preparing PCB-pinou...
- Patent number 11,641,072
- Issue date May 2, 2023
- Huawei Technologies Co., Ltd.
- Weijian Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20220148950
- Publication date May 12, 2022
- Huawei Technologies Co., Ltd
- Weijian PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB-PINOUT BASED PACKAGED MODULE AND METHOD FOR PREPARING PCB-PINOU...
- Publication number 20210280998
- Publication date Sep 9, 2021
- Huawei Technologies Co., Ltd
- Weijian PAN
- H01 - BASIC ELECTRIC ELEMENTS