Weili Wang

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including vertical wire bonds
- Patent number 11,749,647
- Issue date Sep 5, 2023
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant material for photovoltaic modules and method of prepari...
- Patent number 10,872,989
- Issue date Dec 22, 2020
- TIGER NEW SURFACE MATERIALS (SUZHOU) CO., LTD.
- Tianhe Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic assembly
- Patent number 10,553,737
- Issue date Feb 4, 2020
- SUNMAN (HONG KONG) LIMITED
- Zhengrong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including corner recess
- Patent number 10,418,334
- Issue date Sep 17, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer layer for embedding semiconductor die
- Patent number 9,462,694
- Issue date Oct 4, 2016
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for separating a diced semiconductor die from a die attach tape
- Patent number 8,499,813
- Issue date Aug 6, 2013
- SanDisk Technologies Inc.
- Jack Chang Chien
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
- Publication number 20220181208
- Publication date Jun 9, 2022
- Western Digital Technologies, Inc.
- Xin Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
- Publication number 20210366875
- Publication date Nov 25, 2021
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC ASSEMBLY
- Publication number 20190252563
- Publication date Aug 15, 2019
- Sunman (Hong Kong) Limited
- Zhengrong SHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ENCAPSULANT MATERIAL FOR PHOTOVOLTAIC MODULES AND METHOD OF PREPARI...
- Publication number 20190097071
- Publication date Mar 28, 2019
- TIGER NEW SURFACE MATERIALS (SUZHOU) CO., LTD.
- Tianhe DAI
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
ENCAPSULANT MATERIAL FOR PHOTOVOLTAIC MODULES AND METHOD OF PREPARI...
- Publication number 20180374974
- Publication date Dec 27, 2018
- TIGER NEW SURFACE MATERIALS (SUZHOU) CO., LTD.
- Tianhe DAI
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS
- Publication number 20180174983
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20170179101
- Publication date Jun 22, 2017
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER LAYER FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187421
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- G11 - INFORMATION STORAGE
Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150155247
- Publication date Jun 4, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
- Publication number 20120145332
- Publication date Jun 14, 2012
- Jack Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
- Publication number 20110084377
- Publication date Apr 14, 2011
- Jack Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device including vertical wire bonds

Encapsulant material for photovoltaic modules and method of prepari...

Photovoltaic assembly

Semiconductor device including corner recess

Semiconductor device including independent film layer for embedding...

Spacer layer for embedding semiconductor die

System for separating a diced semiconductor die from a die attach tape

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

PHOTOVOLTAIC ASSEMBLY

ENCAPSULANT MATERIAL FOR PHOTOVOLTAIC MODULES AND METHOD OF PREPARI...

ENCAPSULANT MATERIAL FOR PHOTOVOLTAIC MODULES AND METHOD OF PREPARI...

SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS

BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...

SPACER LAYER FOR EMBEDDING SEMICONDUCTOR DIE

BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE

SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE

SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE