Weimin Chen

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Thin semiconductor package and method for manufacturing same
- Patent number 8,354,739
- Issue date Jan 15, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yeqing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling stackable semiconductor packages
- Patent number 7,888,186
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110316130
- Publication date Dec 29, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Yeqing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING STACKABLE SEMICONDUCTOR PACKAGES
- Publication number 20100317152
- Publication date Dec 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS