Weiming Chris Chen

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 12,062,590
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer structure with Chiplet Interposer
- Patent number 12,027,455
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet interposer
- Patent number 11,996,371
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipation films and manufacturing...
- Patent number 11,728,238
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,696
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,462,418
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 11,444,038
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer structure with chiplet interposer
- Patent number 11,380,611
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a heat dissipating element and method of man...
- Patent number 11,164,855
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,139,282
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 10,515,906
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a multi-thermal interface ma...
- Patent number 10,515,869
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,510,722
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having die structures of different heights
- Patent number 10,319,699
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging with substrates connected by conductive bumps
- Patent number 10,304,800
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240387198
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER
- Publication number 20240312898
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET INTERPOSER
- Publication number 20240266303
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386985
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230085054
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEIMING CHRIS CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230050785
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220359231
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Large Chips Through Stitching
- Publication number 20220359433
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20220336321
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Wafer Structure with Chiplet Interposer
- Publication number 20220328395
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET INTERPOSER
- Publication number 20220262742
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER
- Publication number 20210305146
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20210225666
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210082894
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035884
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200144155
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200118979
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- WEIMING CHRIS CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Large Chips Through Stitching
- Publication number 20200111755
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200035655
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING A MULTI-THERMAL INTERFACE MA...
- Publication number 20190371700
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180374821
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- WEIMING CHRIS CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180366440
- Publication date Dec 20, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- WEIMING CHRIS CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Having Die Structures of Different Heights and Method...
- Publication number 20180040586
- Publication date Feb 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Large Chips Through Stitching
- Publication number 20170373022
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS

Weiming Chris Chen

Person

Patents Grantslast 30 patents

Forming large chips through stitching

Method for manufacturing semiconductor package structure

Chip-on-wafer structure with Chiplet Interposer

Chiplet interposer

Semiconductor package with heat dissipation films and manufacturing...

Semiconductor device

Integrated circuit package and method

Forming large chips through stitching

Chip-on-wafer structure with chiplet interposer

Package structure with a heat dissipating element and method of man...

Semiconductor package structure and method for manufacturing the same

Forming large chips through stitching

Semiconductor package structure having a multi-thermal interface ma...

Semiconductor device and method for manufacturing the same

Chip package having die structures of different heights

Packaging with substrates connected by conductive bumps

Patents Applicationslast 30 patents

FORMING LARGE CHIPS THROUGH STITCHING

Chip Singulation Assisted Structures and Methods for Improving Bond...

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE STRUCTURE

CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER

CHIPLET INTERPOSER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method

Forming Large Chips Through Stitching

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Chip-On-Wafer Structure with Chiplet Interposer

CHIPLET INTERPOSER

CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER

INTEGRATED CIRCUIT PACKAGE AND METHOD

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

Forming Large Chips Through Stitching

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE HAVING A MULTI-THERMAL INTERFACE MA...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Chip Package Having Die Structures of Different Heights and Method...

Forming Large Chips Through Stitching