Weiting Jiang

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Die separation ring for wafers having a large die aspect ratio
- Patent number 12,347,733
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package mold flow control system and method
- Patent number 12,062,625
- Issue date Aug 13, 2024
- SanDisk Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with exposed bond wires
- Patent number 11,942,459
- Issue date Mar 26, 2024
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structures for memory devices
- Patent number 10,607,955
- Issue date Mar 31, 2020
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION
- Publication number 20250132205
- Publication date Apr 24, 2025
- Western Digital Technologies, Inc.
- Fan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...
- Publication number 20250096058
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- Huoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Cutting With Electron Removal
- Publication number 20230411179
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Cong ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
- Publication number 20230377972
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Exposed Bond Wires
- Publication number 20230260975
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Improved Conductive Stub Coverage
- Publication number 20230129628
- Publication date Apr 27, 2023
- Western Digital Technologies, Inc.
- Simon Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Mold Flow Control System and Method
- Publication number 20230102959
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS FAN-OUT STRUCTURES FOR MEMORY DEVICES
- Publication number 20180366429
- Publication date Dec 20, 2018
- SunDisk Semiconductro (Shanghai) Co. Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...
- Publication number 20160086827
- Publication date Mar 24, 2016
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Peng Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...
- Publication number 20140346686
- Publication date Nov 27, 2014
- Fu Peng
- H01 - BASIC ELECTRIC ELEMENTS

Weiting Jiang

Person

Patents Grantslast 30 patents

Die separation ring for wafers having a large die aspect ratio

Semiconductor device package mold flow control system and method

Semiconductor device package with exposed bond wires

Heterogeneous fan-out structures for memory devices

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION

STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...

Laser Cutting With Electron Removal

DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO

Semiconductor Device Package with Exposed Bond Wires

Semiconductor Device Package Having Improved Conductive Stub Coverage

Semiconductor Device Package Mold Flow Control System and Method

HETEROGENEOUS FAN-OUT STRUCTURES FOR MEMORY DEVICES

METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...

METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVIC...