Wen-Bo Ding

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,622,253
- Issue date Apr 14, 2020
- United Microelectronics Corp.
- Li-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method
- Patent number 10,580,823
- Issue date Mar 3, 2020
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device for reducing grain siz...
- Patent number 9,852,912
- Issue date Dec 26, 2017
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190378757
- Publication date Dec 12, 2019
- United Microelectronics Corp.
- Li-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD
- Publication number 20180323227
- Publication date Nov 8, 2018
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS