Wen Ching Liao

Person

Hsin Tien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,364,067
- Issue date Jul 15, 2025
- Epistar Corporation
- Chun-Yu Lin
Information Patent Grant
Centrifugal heat dissipation fan
- Patent number 12,349,309
- Issue date Jul 1, 2025
- Acer Incorporated
- Yu-Ming Lin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
High-electron mobility transistor and fabrication method thereof
- Patent number 12,342,561
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 12,334,625
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,328,889
- Issue date Jun 10, 2025
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure
- Patent number 12,322,686
- Issue date Jun 3, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution detector
- Patent number 12,313,616
- Issue date May 27, 2025
- Innolux Corporation
- Fuh-Tsang Wu
- G01 - MEASURING TESTING
Information Patent Grant
Thermally tunable waveguide and photonic integrated circuit compone...
- Patent number 12,306,436
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 12,300,556
- Issue date May 13, 2025
- Innolux Corporation
- Chih-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics card and computer host
- Patent number 12,289,866
- Issue date Apr 29, 2025
- Acer Incorporated
- Yu-Ming Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nitride semiconductor device and manufacturing method thereof
- Patent number 12,289,914
- Issue date Apr 29, 2025
- United Microelectronics Corp.
- Chih Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for generating a parameterized waveguide optic...
- Patent number 12,288,021
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for forming the same
- Patent number 12,266,701
- Issue date Apr 1, 2025
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,266,696
- Issue date Apr 1, 2025
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof structure of socket connector
- Patent number 12,261,392
- Issue date Mar 25, 2025
- JESS-LINK PRODUCTS CO., LTD.
- Ming-Jun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,255,157
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal heat dissipation fan of portable electronic device
- Patent number 12,219,731
- Issue date Feb 4, 2025
- Acer Incorporated
- Tsung-Ting Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Graphics card assembly
- Patent number 12,219,732
- Issue date Feb 4, 2025
- Acer Incorporated
- Yu-Ming Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with antenna and method of forming the same
- Patent number 12,206,157
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for forming the same
- Patent number 12,206,000
- Issue date Jan 21, 2025
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for forminginsulating structure of high electr...
- Patent number 12,199,175
- Issue date Jan 14, 2025
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,176
- Issue date Jan 14, 2025
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 12,191,265
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,164,152
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package with interposer formed by spin on process
- Patent number 12,154,846
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure
- Patent number 12,148,685
- Issue date Nov 19, 2024
- INNOLUX CORPORATION
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation system of electronic device
- Patent number 12,140,159
- Issue date Nov 12, 2024
- Acer Incorporated
- Tsung-Ting Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE SILICON LENS
- Publication number 20250237812
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20250204005
- Publication date Jun 19, 2025
- UNITED MICROELECTRONICS CORP.
- Chih-Tung Yeh
Information Patent Application
WALL MOUNTING DEVICE FOR MOUNTING A SCANNER
- Publication number 20250203023
- Publication date Jun 19, 2025
- FOXLINK IMAGE TECHNOLOGY CO., LTD.
- Wen Chu Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20250183202
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140671
- Publication date May 1, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140716
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS AND...
- Publication number 20250133753
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME
- Publication number 20250125519
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Method
- Publication number 20250096167
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250062188
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20250060537
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250038089
- Publication date Jan 30, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250029910
- Publication date Jan 23, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250014913
- Publication date Jan 9, 2025
- Innolux Corporation
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015173
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Shin-Chuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015142
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...
- Publication number 20250006669
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429193
- Publication date Dec 26, 2024
- InnoLux Corporation
- Pei-Yin CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421031
- Publication date Dec 19, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiband QAM Interface for Slab Waveguide
- Publication number 20240395738
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS
- Publication number 20240395684
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Shiang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS
- Publication number 20240385369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240387980
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET HEAD CHIP IDENTIFICATION CIRCUIT
- Publication number 20240383255
- Publication date Nov 21, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR OPTICAL COUPLING AND SYSTEM FOR COMMUNICATION
- Publication number 20240369770
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
LOCKING MECHANISM FOR REMOVABLY LOCKING AN EXPANSION ELECTRICAL COM...
- Publication number 20240373572
- Publication date Nov 7, 2024
- Jabil Circuit (Singapore) Pte. Ltd.
- Chen-Lu Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS

Wen Ching Liao

Person

Patents Grantslast 30 patents

Semiconductor device

Centrifugal heat dissipation fan

High-electron mobility transistor and fabrication method thereof

Antenna apparatus and method

High electron mobility transistor and method for fabricating the same

Redistribution layer structure

Solution detector

Thermally tunable waveguide and photonic integrated circuit compone...

Electronic device and method for manufacturing the same

Graphics card and computer host

Nitride semiconductor device and manufacturing method thereof

Apparatus and method for generating a parameterized waveguide optic...

Integrated fan-out package with 3D magnetic core inductor

High electron mobility transistor and method for forming the same

Manufacturing method of semiconductor device

Waterproof structure of socket connector

Semiconductor package device with integrated inductor and manufactu...

Centrifugal heat dissipation fan of portable electronic device

Graphics card assembly

Semiconductor package with antenna and method of forming the same

High electron mobility transistor and method for forming the same

Manufacturing method for forminginsulating structure of high electr...

Semiconductor device

Antenna apparatus and method

Embedded metal insulator metal structure

Method of fabricating semiconductor structure

Interposer directly bonded to bonding pads on a plurality of dies

3DIC package with interposer formed by spin on process

Redistribution layer structure

Heat dissipation system of electronic device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH DOUBLE SILICON LENS

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME

WALL MOUNTING DEVICE FOR MOUNTING A SCANNER

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

HEAT DISSIPATION BY NANO PIPES

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS AND...

SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME

Antenna Apparatus and Method

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

ELECTRONIC DEVICE

ELECTRONIC COMPONENT

ELECTRONIC DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Multiband QAM Interface for Slab Waveguide

3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS

SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS

METHOD OF FORMING SEMICONDUCTOR DEVICES

INKJET HEAD CHIP IDENTIFICATION CIRCUIT

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

PACKAGE

APPARATUS FOR OPTICAL COUPLING AND SYSTEM FOR COMMUNICATION

LOCKING MECHANISM FOR REMOVABLY LOCKING AN EXPANSION ELECTRICAL COM...

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...