Wen Ching Liao

Person

Hsin Tien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer structure
- Patent number 12,148,685
- Issue date Nov 19, 2024
- INNOLUX CORPORATION
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation system of electronic device
- Patent number 12,140,159
- Issue date Nov 12, 2024
- Acer Incorporated
- Tsung-Ting Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,142,554
- Issue date Nov 12, 2024
- INNOLUX CORPORATION
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoconductive structure of socket connector
- Patent number 12,142,872
- Issue date Nov 12, 2024
- JESS-LINK PRODUCTS CO., LTD.
- Ming-Jun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 12,131,917
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,125,885
- Issue date Oct 22, 2024
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,125,903
- Issue date Oct 22, 2024
- United Microelectronics Corp.
- Shin-Chuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of capacitor structure including patterned con...
- Patent number 12,113,098
- Issue date Oct 8, 2024
- United Microelectronics Corp.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal heat dissipation fan
- Patent number 12,104,603
- Issue date Oct 1, 2024
- Acer Incorporated
- Cheng-Wen Hsieh
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Fall arrester
- Patent number 12,076,594
- Issue date Sep 3, 2024
- YOKE INDUSTRIAL CORP.
- Wei-Chieh Hung
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Fall arrester
- Patent number 12,076,595
- Issue date Sep 3, 2024
- YOKE INDUSTRIAL CORP.
- Wei-Chieh Hung
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optical devices and methods of forming the same
- Patent number 12,066,658
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Apparatus for optical coupling and system for communication
- Patent number 12,066,662
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Multiband QAM interface for slab waveguide
- Patent number 12,062,629
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,046,544
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation system of portable electronic device
- Patent number 12,035,503
- Issue date Jul 9, 2024
- Acer Incorporated
- Tsung-Ting Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,027,604
- Issue date Jul 2, 2024
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,027,478
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber structure
- Patent number 12,025,382
- Issue date Jul 2, 2024
- Acer Incorporated
- Chun-Chieh Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manufacturing method of narrow type inkjet print head chip
- Patent number 12,005,711
- Issue date Jun 11, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Power management semiconductor package and manufacturing method the...
- Patent number 12,002,770
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rope based fall protection device
- Patent number 11,998,776
- Issue date Jun 4, 2024
- YOKE INDUSTRIAL CORP.
- Wen-Ming Liao
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Package structure
- Patent number 11,978,697
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing of fall arrester
- Patent number D1023729
- Issue date Apr 23, 2024
- YOKE INDUSTRIAL CORP.
- Wei-Chieh Hung
- D08 - Tools and hardware
Information Patent Grant
Centrifugal heat dissipation fan and heat dissipation system of ele...
- Patent number 11,968,800
- Issue date Apr 23, 2024
- Acer Incorporated
- Tsung-Ting Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna apparatus and method
- Patent number 11,961,809
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cycling heat dissipation module
- Patent number 11,953,272
- Issue date Apr 9, 2024
- Acer Incorporated
- Cheng-Yu Cheng
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally tunable waveguide and photonic integrated circuit compone...
- Patent number 11,953,723
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS
- Publication number 20240385369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240387980
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET HEAD CHIP IDENTIFICATION CIRCUIT
- Publication number 20240383255
- Publication date Nov 21, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR OPTICAL COUPLING AND SYSTEM FOR COMMUNICATION
- Publication number 20240369770
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING MECHANISM FOR REMOVABLY LOCKING AN EXPANSION ELECTRICAL COM...
- Publication number 20240373572
- Publication date Nov 7, 2024
- Jabil Circuit (Singapore) Pte. Ltd.
- Chen-Lu Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL INSULATOR METAL STRUCTURE
- Publication number 20240363505
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240361527
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20240355720
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YING-CHIH HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR
- Publication number 20240339369
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339392
- Publication date Oct 10, 2024
- InnoLux Corporation
- Chih-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONNECTING CABLE
- Publication number 20240332824
- Publication date Oct 3, 2024
- JESS-LINK PRODUCTS CO., LTD.
- Yun-Chang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERPROOF ELECTRICAL CONNECTION DEVICE
- Publication number 20240332853
- Publication date Oct 3, 2024
- JESS-LINK PRODUCTS CO., LTD.
- Yun-Chang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240329304
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HUAN-NENG CHEN
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240332158
- Publication date Oct 3, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240322008
- Publication date Sep 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240243051
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR GENERATING A PARAMETERIZED WAVEGUIDE OPTIC...
- Publication number 20240232499
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng-Wei KUO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CENTRIFUGAL HEAT DISSIPATION FAN OF PORTABLE ELECTRONIC DEVICE
- Publication number 20240237268
- Publication date Jul 11, 2024
- ACER INCORPORATED
- Tsung-Ting Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240234539
- Publication date Jul 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240222437
- Publication date Jul 4, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PHOTO-DETECTING DEVICE
- Publication number 20240222538
- Publication date Jul 4, 2024
- EPISTAR CORPORATION
- Chu-Jih SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY TUNABLE WAVEGUIDE AND PHOTONIC INTEGRATED CIRCUIT COMPONE...
- Publication number 20240210617
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240206193
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240201439
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240170385
- Publication date May 23, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20240162313
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Tung Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Wen Ching Liao

Person

Patents Grantslast 30 patents

Redistribution layer structure

Heat dissipation system of electronic device

Electronic component and manufacturing method thereof

Thermoconductive structure of socket connector

Manufacturing method of package structure

Package

Semiconductor device and manufacturing method thereof

High electron mobility transistor and method for fabricating the same

Manufacturing method of capacitor structure including patterned con...

Centrifugal heat dissipation fan

Fall arrester

Fall arrester

Coaxial through via with novel high isolation cross coupling method...

Integrated optical devices and methods of forming the same

Apparatus for optical coupling and system for communication

Multiband QAM interface for slab waveguide

Semiconductor package device with integrated inductor and manufactu...

Heat dissipation system of portable electronic device

High electron mobility transistor and method for fabricating the same

Manufacturing method of semiconductor structure

Vapor chamber structure

Manufacturing method of narrow type inkjet print head chip

Power management semiconductor package and manufacturing method the...

Rope based fall protection device

Package structure

Housing of fall arrester

Centrifugal heat dissipation fan and heat dissipation system of ele...

Antenna apparatus and method

Cycling heat dissipation module

Thermally tunable waveguide and photonic integrated circuit compone...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS

METHOD OF FORMING SEMICONDUCTOR DEVICES

INKJET HEAD CHIP IDENTIFICATION CIRCUIT

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

APPARATUS FOR OPTICAL COUPLING AND SYSTEM FOR COMMUNICATION

PACKAGE

LOCKING MECHANISM FOR REMOVABLY LOCKING AN EXPANSION ELECTRICAL COM...

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

EMBEDDED METAL INSULATOR METAL STRUCTURE

INTEGRATED OPTICAL DEVICES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR

ELECTRONIC DEVICE

ELECTRIC CONNECTING CABLE

WATERPROOF ELECTRICAL CONNECTION DEVICE

WAVEGUIDE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE

APPARATUS AND METHOD FOR GENERATING A PARAMETERIZED WAVEGUIDE OPTIC...

CENTRIFUGAL HEAT DISSIPATION FAN OF PORTABLE ELECTRONIC DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PHOTO-DETECTING DEVICE

THERMALLY TUNABLE WAVEGUIDE AND PHOTONIC INTEGRATED CIRCUIT COMPONE...

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME