TREA

WEN-FU YU

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  • Taipei City, TW
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Patents Applicationslast 30 patents

  • Information Patent Application

    SENSOR PACKAGE STRUCTURE
    • Publication number 20240128139
    • Publication date Apr 18, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • WEI-LI WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGE STRUCTURE
    • Publication number 20240128291
    • Publication date Apr 18, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • CHIA-SHUAI CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF
    • Publication number 20240128233
    • Publication date Apr 18, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • CHIA-SHUAI CHANG
    • H01 - BASIC ELECTRIC ELEMENTS