Wen-Hsin Chan

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of multiple transistors having fin and mesa structures
- Patent number 12,283,595
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavities for center-pinned actuator cooling systems
- Patent number 12,193,192
- Issue date Jan 7, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,848,367
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure wi...
- Patent number 11,081,571
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,018,234
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,867,852
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ruei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure wi...
- Patent number 10,727,321
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure wi...
- Patent number 10,505,023
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure wi...
- Patent number 10,147,805
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure
- Patent number 10,008,568
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped protection layer for contact formation
- Patent number 9,991,123
- Issue date Jun 5, 2018
- TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
- Mei-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped protection layer for contact formation
- Patent number 9,647,087
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mei-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,589,915
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped protection layer for contact formation
- Patent number 9,136,340
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mei-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS
- Publication number 20250089219
- Publication date Mar 13, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS
- Publication number 20240215204
- Publication date Jun 27, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240072144
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Wen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Multiple Transistors Having Fin and Mesa Structures
- Publication number 20230154922
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210280681
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Wen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20200343360
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20200066873
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200035799
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Wen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20190109206
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED PROTECTION LAYER FOR CONTACT FORMATION
- Publication number 20170236716
- Publication date Aug 17, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mei-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170170067
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ruei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20170033194
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Lung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20160293702
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Lung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160020181
- Publication date Jan 21, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-YUAN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED PROTECTION LAYER FOR CONTACT FORMATION
- Publication number 20150380516
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Mei-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED PROTECTION LAYER FOR CONTACT FORMATION
- Publication number 20140361364
- Publication date Dec 11, 2014
- Mei-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Wen-Hsin Chan

Person

Patents Grantslast 30 patents

Integration of multiple transistors having fin and mesa structures

Cavities for center-pinned actuator cooling systems

Method for manufacturing semiconductor device

Structure and formation method of semiconductor device structure wi...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Structure and formation method of semiconductor device structure wi...

Structure and formation method of semiconductor device structure wi...

Structure and formation method of semiconductor device structure wi...

Structure and formation method of semiconductor device structure

Doped protection layer for contact formation

Doped protection layer for contact formation

Semiconductor device and manufacturing method thereof

Doped protection layer for contact formation

Patents Applicationslast 30 patents

CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS

CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS

SEMICONDUCTOR DEVICE

Integration of Multiple Transistors Having Fin and Mesa Structures

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

DOPED PROTECTION LAYER FOR CONTACT FORMATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DOPED PROTECTION LAYER FOR CONTACT FORMATION

DOPED PROTECTION LAYER FOR CONTACT FORMATION