Wen Hsin Wei

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 12,021,006
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including through via structures
- Patent number 11,923,310
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,810,833
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through chip-on-wafer-on-substrate
- Patent number 11,728,254
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,527,454
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,456,287
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 11,444,038
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,417,580
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,183,399
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a dummy die of an integrated circuit having an em...
- Patent number 11,101,260
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,101,140
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having line connected via portions
- Patent number 11,088,079
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having die structures of different heights and method...
- Patent number 11,069,657
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,062,971
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,985,137
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,964,667
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,854,567
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,770,365
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having die structures of different heights and method...
- Patent number 10,535,633
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,529,679
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 10,515,906
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having die structures of different heights
- Patent number 10,319,699
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,163,856
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package
- Patent number 10,163,853
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsin Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structures and methods of forming the same
- Patent number 10,153,222
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method for chip package
- Patent number 9,818,720
- Issue date Nov 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS
- Publication number 20240213167
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
- Publication number 20230386945
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20230369162
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20230275101
- Publication date Aug 31, 2023
- AUO Corporation
- I-Peng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20230275100
- Publication date Aug 31, 2023
- AUO Corporation
- I-Peng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20220359355
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220359476
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Large Chips Through Stitching
- Publication number 20220359433
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20220246581
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220102288
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210375769
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
- Publication number 20210366814
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20210343619
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Forming the Same
- Publication number 20210327778
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210320097
- Publication date Oct 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20210242173
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210066151
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200411440
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Forming the Same
- Publication number 20200402877
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20200219786
- Publication date Jul 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Having Die Structures of Different Heights and Method...
- Publication number 20200152602
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20200126938
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Large Chips Through Stitching
- Publication number 20200111755
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20200035647
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200027750
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20190237454
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190148166
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS

Wen Hsin Wei

Person

Patents Grantslast 30 patents

Forming large chips through stitching

Semiconductor device having heat dissipation structure of curved pr...

Package structure and method and equipment for forming the same

Integrated circuit package and method of forming same

Giga interposer integration through Chip-On-Wafer-On-Substrate

Package structure including through via structures

Package structure and method and equipment for forming the same

Giga interposer integration through chip-on-wafer-on-substrate

Package structures and methods of forming the same

Package structure and method of fabricating the same

Forming large chips through stitching

Package structures and methods of forming the same

Semiconductor device and method of manufacture

Method of forming a dummy die of an integrated circuit having an em...

Semiconductor device and method of manufacture

Package structure having line connected via portions

Chip package having die structures of different heights and method...

Package structure and method and equipment for forming the same

Stacked integrated circuit structure and method of forming

Stacked integrated circuit structure and method of forming

3D packages and methods for forming the same

Package structures and methods of forming the same

Chip package having die structures of different heights and method...

3D packages and methods for forming the same

Forming large chips through stitching

Chip package having die structures of different heights

Stacked integrated circuit structure and method of forming

Formation method of chip package

Package structures and methods of forming the same

Structure and formation method for chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...

Package Structure and Method and Equipment for Forming the Same

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL AND DISPLAY DEVICE

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Forming Large Chips Through Stitching

Stacked Integrated Circuit Structure and Method of Forming

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

Giga Interposer Integration through Chip-On-Wafer-On-Substrate

Package Structure and Method and Equipment for Forming the Same

Package Structures and Methods of Forming the Same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Stacked Integrated Circuit Structure and Method of Forming

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Package Structures and Methods of Forming the Same

Package Structure and Method and Equipment for Forming the Same

Chip Package Having Die Structures of Different Heights and Method...

3D Packages and Methods for Forming the Same

Forming Large Chips Through Stitching

Stacked Integrated Circuit Structure and Method of Forming

Semiconductor Device and Method of Manufacture

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Semiconductor Device and Method of Manufacture