Wen-Hsiung Li

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Taichung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183109
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Chien-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174582
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
- Publication number 20130015589
- Publication date Jan 17, 2013
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED package structure
- Publication number 20120119238
- Publication date May 17, 2012
- Forward Electronics Co., Ltd.
- I Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED package structure
- Publication number 20120074443
- Publication date Mar 29, 2012
- Forward Electronics Co., Ltd.
- Wen-Hsiung Li
- H01 - BASIC ELECTRIC ELEMENTS