TREA

Wen-Hsiung Li

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  • Taichung City, TW
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Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
    • Publication number 20130015589
    • Publication date Jan 17, 2013
    • Chih-Chin Liao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LED package structure
    • Publication number 20120119238
    • Publication date May 17, 2012
    • Forward Electronics Co., Ltd.
    • I Chih Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LED package structure
    • Publication number 20120074443
    • Publication date Mar 29, 2012
    • Forward Electronics Co., Ltd.
    • Wen-Hsiung Li
    • H01 - BASIC ELECTRIC ELEMENTS