Wen-Hua Lu

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and circuit layer structure including dummy trace...
- Patent number 12,224,219
- Issue date Feb 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,209,013
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package
- Patent number 12,142,584
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,134,557
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system of building knowledge graph and method and system...
- Patent number 12,086,182
- Issue date Sep 10, 2024
- National Cheng Kung University
- Wen-Hsiang Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,046,523
- Issue date Jul 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array and operation method thereof
- Patent number 12,048,164
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Ling Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method
- Patent number 12,040,256
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of making the same
- Patent number 12,033,870
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 12,009,256
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 11,973,040
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,944
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pad
- Patent number 11,942,445
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one via including concave port...
- Patent number 11,942,398
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,901,266
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,894,241
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal conduction unit, electronic module and heat dissipating device
- Patent number 11,856,856
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,854,835
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 11,817,413
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 11,791,227
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Kuoching Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,776,881
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,769,716
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,721,652
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 11,721,579
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and semiconductor process
- Patent number 11,721,645
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,699,682
- Issue date Jul 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including pillars and method for manufacturing th...
- Patent number 11,694,984
- Issue date Jul 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines having nano columns and method forming same
- Patent number 11,594,508
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE
- Publication number 20240395639
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE
- Publication number 20240383744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME
- Publication number 20240387433
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240321691
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20240290656
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240288745
- Publication date Aug 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- G02 - OPTICS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240266190
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234637
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER
- Publication number 20240222194
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240153849
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF GENERATING KNOWLEDGE GRAPH AND SYSTEM AND METH...
- Publication number 20240143922
- Publication date May 2, 2024
- National Cheng Kung University
- Wen-Hsiang LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240124298
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Chung Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
- Publication number 20240096647
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMORY ARRAY AND OPERATION METHOD THEREOF
- Publication number 20240090230
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling Lu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047403
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240021499
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE
- Publication number 20240017988
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240014105
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20230422513
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230413571
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF BUILDING KNOWLEDGE GRAPH AND METHOD AND SYSTEM...
- Publication number 20230409637
- Publication date Dec 21, 2023
- National Cheng Kung University
- Wen-Hsiang LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20230395468
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE
- Publication number 20230386944
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230387046
- Publication date Nov 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20230352342
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package structure and circuit layer structure including dummy trace...

Arched membrane structure for MEMS device

Semiconductor device package

Arched membrane structure for MEMS device

Method and system of building knowledge graph and method and system...

Semiconductor device packages and methods of manufacturing the same

Memory array and operation method thereof

Semiconductor device and method

Bump structure and method of making the same

Redistribution lines with protection layers and method forming same

Interposer with warpage-relief trenches

Semiconductor device and manufacturing method thereof

Package component with stepped passivation layer

Semiconductor device with conductive pad

Semiconductor device having at least one via including concave port...

Semiconductor device structure and method for forming the same

Heterogeneous bonding structure and method forming same

Micro-electro mechanical system and manufacturing method thereof

Thermal conduction unit, electronic module and heat dissipating device

Heterogeneous bonding structure and method forming same

Semiconductor package structure comprising via structure and redist...

Electronic device package

Semiconductor device and method

Semiconductor device and methods of forming the same

Semiconductor device package and method of manufacturing the same

Redistribution lines with protection layers and method forming same

Semiconductor package device and semiconductor process

Semiconductor device package and method of manufacturing the same

Package structure including pillars and method for manufacturing th...

Redistribution lines having nano columns and method forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE

ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE

REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD

CIRCUIT STRUCTURE

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

SEMICONDUCTOR DEVICES

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SYSTEM AND METHOD OF GENERATING KNOWLEDGE GRAPH AND SYSTEM AND METH...

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

MEMORY ARRAY AND OPERATION METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

Semiconductor Device and Method

ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

FERROELECTRIC DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD AND SYSTEM OF BUILDING KNOWLEDGE GRAPH AND METHOD AND SYSTEM...

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME