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last 30 patents
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Patent Grant
Interposer with warpage-relief trenches
Patent number
11,973,040
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Yang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,944
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-En Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package component with stepped passivation layer
Patent number
11,961,762
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with conductive pad
Patent number
11,942,445
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-En Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having at least one via including concave port...
Patent number
11,942,398
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and method for forming the same
Patent number
11,901,266
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous bonding structure and method forming same
Patent number
11,894,241
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Mirng-Ji Lii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-electro mechanical system and manufacturing method thereof
Patent number
11,851,321
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Li Yang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Thermal conduction unit, electronic module and heat dissipating device
Patent number
11,856,856
Issue date
Dec 26, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous bonding structure and method forming same
Patent number
11,854,835
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Mirng-Ji Lii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure comprising via structure and redist...
Patent number
11,817,413
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Neng-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
11,791,227
Issue date
Oct 17, 2023
Advanced Semiconductor Engineering, Inc.
Kuoching Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,776,881
Issue date
Oct 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsu-Lun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and methods of forming the same
Patent number
11,769,716
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,721,652
Issue date
Aug 8, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution lines with protection layers and method forming same
Patent number
11,721,579
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device and semiconductor process
Patent number
11,721,645
Issue date
Aug 8, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,699,682
Issue date
Jul 11, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including pillars and method for manufacturing th...
Patent number
11,694,984
Issue date
Jul 4, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution lines having nano columns and method forming same
Patent number
11,594,508
Issue date
Feb 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,569,419
Issue date
Jan 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-En Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,538,760
Issue date
Dec 27, 2022
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring structure and method for manufacturing the same
Patent number
11,532,542
Issue date
Dec 20, 2022
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging devices and methods of manufacture thereof
Patent number
11,527,490
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing semiconductor device and semiconductor device
Patent number
11,502,044
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Hua Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,495,557
Issue date
Nov 8, 2022
Advanced Semiconductor Engineering, Inc.
Jhao-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package component with stepped passivation layer
Patent number
11,450,567
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Housing device with combination structures
Patent number
11,452,217
Issue date
Sep 20, 2022
CHICONY POWER TECHNOLOGY CO., LTD.
Wen-Yung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and circuit layer structure including dummy trace...
Patent number
11,430,708
Issue date
Aug 30, 2022
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure and method of making the same
Patent number
11,417,539
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Hsiung Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240153849
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Li YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD OF GENERATING KNOWLEDGE GRAPH AND SYSTEM AND METH...
Publication number
20240143922
Publication date
May 2, 2024
National Cheng Kung University
Wen-Hsiang LU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Semiconductor Devices and Methods of Manufacture
Publication number
20240124298
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yun-Chung Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240120207
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lung-Kai Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
Publication number
20240096647
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Mirng-Ji Lii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY ARRAY AND OPERATION METHOD THEREOF
Publication number
20240090230
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Ling Lu
G11 - INFORMATION STORAGE
Information
Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
Publication number
20240083742
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Li YANG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240047403
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20240021499
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsu-Lun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE
Publication number
20240017988
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jhao-Yi Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240014105
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FERROELECTRIC DEVICE AND METHODS OF FORMING THE SAME
Publication number
20230422513
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20230413571
Publication date
Dec 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Ling LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND SYSTEM OF BUILDING KNOWLEDGE GRAPH AND METHOD AND SYSTEM...
Publication number
20230409637
Publication date
Dec 21, 2023
National Cheng Kung University
Wen-Hsiang LU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
Publication number
20230395468
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE
Publication number
20230386944
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Yang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230387046
Publication date
Nov 30, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
Publication number
20230352342
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Bonding Pads and Methods of Forming the Same
Publication number
20230307392
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Hsiung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FERROELECTRIC MEMORY DEVICE AND METHOD OF MAKING THE SAME
Publication number
20230262986
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Ling LU
G11 - INFORMATION STORAGE
Information
Patent Application
VEHICLE DRIVING CONTROL APPARATUS AND CONTROL METHOD AND DISPLAY ME...
Publication number
20230166726
Publication date
Jun 1, 2023
Industrial Technology Research Institute
Kun-Lung Ku
B60 - VEHICLES IN GENERAL
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230170443
Publication date
Jun 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-En Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Lines Having Nano Columns and Method Forming Same
Publication number
20230154880
Publication date
May 18, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230060982
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Li YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230063096
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230067826
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230027674
Publication date
Jan 26, 2023
Advanced Semiconductor Engineering, Inc.
Jhao-Cheng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND CIRCUIT LAYER STRUCTURE INCLUDING DUMMY TRACE...
Publication number
20220415739
Publication date
Dec 29, 2022
Advanced Semiconductor Engineering, Inc.
Wen-Long LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heterogeneous Bonding Structure and Method Forming Same
Publication number
20220384210
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufactuning Co., Ltd.
Mirng-Ji Lii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220367304
Publication date
Nov 17, 2022
Advanced Semiconductor Engineering, Inc.
Kuoching CHENG
H01 - BASIC ELECTRIC ELEMENTS