Wen-Hua Sun

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with a protection layer
- Patent number 7,525,139
- Issue date Apr 28, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming filling paste structure of WL package
- Patent number 7,476,565
- Issue date Jan 13, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with coplanar filling paste and dice and with p...
- Patent number 7,400,037
- Issue date Jul 15, 2008
- Advanced Chip Engineering Tachnology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FBGA and COB package structure for image sensor
- Patent number 7,279,782
- Issue date Oct 9, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 7,224,061
- Issue date May 29, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circumferential Frame for Attachment to an Edge of a Photovoltaic M...
- Publication number 20140102516
- Publication date Apr 17, 2014
- WEN-YU SUN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF PLASMA ETCHING WITH PATTERN MASK
- Publication number 20080268647
- Publication date Oct 30, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling paste structure and process for WL-CSP
- Publication number 20080044945
- Publication date Feb 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLASMA ETCHING WITH PATTERN MASK
- Publication number 20070262051
- Publication date Nov 15, 2007
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mobile phone with automatic recording function
- Publication number 20070178890
- Publication date Aug 2, 2007
- Wen-Hua Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Mobile phone with automatic recording function
- Publication number 20070178934
- Publication date Aug 2, 2007
- Wen-Hua Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Mobile phone with automatic recording function
- Publication number 20060287000
- Publication date Dec 21, 2006
- Wen-Hua Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Mobile Phone with Voice Recording Function for Fixed Line Telephone
- Publication number 20060287002
- Publication date Dec 21, 2006
- Wen-Hua Sun
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FBGA and COB package structure for image sensor
- Publication number 20060145325
- Publication date Jul 6, 2006
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling paste structure and process for WL-CSP
- Publication number 20060145364
- Publication date Jul 6, 2006
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure
- Publication number 20060033196
- Publication date Feb 16, 2006
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imagine sensor with a protection layer
- Publication number 20050242409
- Publication date Nov 3, 2005
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Wen-Hua Sun

Person

Patents Grantslast 30 patents

Image sensor with a protection layer

Method for forming filling paste structure of WL package

Packaging structure with coplanar filling paste and dice and with p...

FBGA and COB package structure for image sensor

Package structure

Patents Applicationslast 30 patents

Circumferential Frame for Attachment to an Edge of a Photovoltaic M...

METHOD OF PLASMA ETCHING WITH PATTERN MASK

Filling paste structure and process for WL-CSP

METHOD OF PLASMA ETCHING WITH PATTERN MASK

Mobile phone with automatic recording function

Mobile phone with automatic recording function

Mobile phone with automatic recording function

Mobile Phone with Voice Recording Function for Fixed Line Telephone

FBGA and COB package structure for image sensor

Filling paste structure and process for WL-CSP

Package structure

Imagine sensor with a protection layer