Wen-Kai Wan

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,587,846
- Issue date Feb 21, 2023
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal via arrangement for multi-channel semiconductor device
- Patent number 10,741,469
- Issue date Aug 11, 2020
- Mediatek Inc.
- Hsien-Hsin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stacked contact with low aspect ratio
- Patent number 8,450,200
- Issue date May 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment of metal interconnect lines
- Patent number 8,053,894
- Issue date Nov 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked contact with low aspect ratio
- Patent number 7,880,303
- Issue date Feb 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fault detection system and method
- Patent number 7,791,070
- Issue date Sep 7, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure for integrated circuit chips
- Patent number 7,777,338
- Issue date Aug 17, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Yao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Bond pad structure with stress-buffering layer capping interconnect...
- Patent number 7,741,714
- Issue date Jun 22, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an interconnection structure for ic metallization
- Patent number 7,291,557
- Issue date Nov 6, 2007
- Taiwan Semiconductor Manufacturing Company
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treated low-k dielectric as diffusion barrier for copper me...
- Patent number 7,271,103
- Issue date Sep 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing stress-induced voiding in an interconnect of...
- Patent number 7,042,097
- Issue date May 9, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment of metal interconnect lines
- Patent number 6,955,984
- Issue date Oct 18, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and pattern for reducing interconnect failures
- Patent number 6,831,365
- Issue date Dec 14, 2004
- Taiwan Semiconductor Manufacturing, Co.
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having high-K gate dielec...
- Patent number 6,746,900
- Issue date Jun 8, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230154824
- Publication date May 18, 2023
- MEDIATEK INC.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220059429
- Publication date Feb 24, 2022
- MEDIATEK INC.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL VIA ARRANGEMENT FOR MULTI-CHANNEL SEMICONDUCTOR DEVICE
- Publication number 20180138104
- Publication date May 17, 2018
- MEDIATEK INC.
- Hsien-Hsin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Stacked Contact with Low Aspect Ratio
- Publication number 20110092019
- Publication date Apr 21, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked contact with low aspect ratio
- Publication number 20080191352
- Publication date Aug 14, 2008
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fault detection system and method
- Publication number 20070096092
- Publication date May 3, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for reducing stress-induced voiding in an interconnect of...
- Publication number 20060108696
- Publication date May 25, 2006
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure with stress-buffering layer capping interconnect...
- Publication number 20060091536
- Publication date May 4, 2006
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure for IC metallization
- Publication number 20060057841
- Publication date Mar 16, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for enhancing die saw and packaging reliability
- Publication number 20060055002
- Publication date Mar 16, 2006
- Taiwan Semiconductor Manufacturing Co.
- Chih-Hsiang Yao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Seal ring structure for integrated circuit chips
- Publication number 20060055007
- Publication date Mar 16, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Yao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Surface treatment of metal interconnect lines
- Publication number 20060001160
- Publication date Jan 5, 2006
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treated low-k dielectric as diffusion barrier for copper me...
- Publication number 20050085083
- Publication date Apr 21, 2005
- Kuei-Wu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for reducing stress-induced voiding in an interconnect of...
- Publication number 20040245639
- Publication date Dec 9, 2004
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PATTERN FOR REDUCING INTERCONNECT FAILURES
- Publication number 20040238959
- Publication date Dec 2, 2004
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treatment of metal interconnect lines
- Publication number 20040229460
- Publication date Nov 18, 2004
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS

Wen-Kai Wan

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming the same

Thermal via arrangement for multi-channel semiconductor device

Method for stacked contact with low aspect ratio

Surface treatment of metal interconnect lines

Stacked contact with low aspect ratio

Semiconductor device fault detection system and method

Seal ring structure for integrated circuit chips

Bond pad structure with stress-buffering layer capping interconnect...

Method for forming an interconnection structure for ic metallization

Surface treated low-k dielectric as diffusion barrier for copper me...

Structure for reducing stress-induced voiding in an interconnect of...

Surface treatment of metal interconnect lines

Method and pattern for reducing interconnect failures

Method for forming a semiconductor device having high-K gate dielec...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

THERMAL VIA ARRANGEMENT FOR MULTI-CHANNEL SEMICONDUCTOR DEVICE

Method for Stacked Contact with Low Aspect Ratio

Stacked contact with low aspect ratio

Semiconductor device fault detection system and method

Structure for reducing stress-induced voiding in an interconnect of...

Bond pad structure with stress-buffering layer capping interconnect...

Interconnection structure for IC metallization

Methods for enhancing die saw and packaging reliability

Seal ring structure for integrated circuit chips

Surface treatment of metal interconnect lines

Surface treated low-k dielectric as diffusion barrier for copper me...

Structure for reducing stress-induced voiding in an interconnect of...

METHOD AND PATTERN FOR REDUCING INTERCONNECT FAILURES

Surface treatment of metal interconnect lines