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Patents Grants
last 30 patents
Information
Patent Grant
Through-silicon via and method for forming the same
Patent number
8,486,805
Issue date
Jul 16, 2013
Institute of Microelectronics, Chinese Academy of Sciences
Chao Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
8,415,222
Issue date
Apr 9, 2013
Institute of Microelectronics, Chinese Academy of Sciences
Wenwu Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
THROUGH-SILICON VIA AND METHOD FOR FORMING THE SAME
Publication number
20120223431
Publication date
Sep 6, 2012
Institute of Microelectronics, Chinese Academy of Sciences
Chao Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20120021584
Publication date
Jan 26, 2012
Institute of Microelectronics, Chinese Academy of Sciences
Wenwu Wang
H01 - BASIC ELECTRIC ELEMENTS