Wen-Ping Tu

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for probe pin retrieval
- Patent number 12,332,291
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Cheng Hsu
- G01 - MEASURING TESTING
Information Patent Grant
Probe card needle shape and method of manufacturing
- Patent number 12,326,463
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Chiu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High voltage passive device structure
- Patent number 12,327,785
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure having common connection...
- Patent number 12,218,186
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe assembly with multiple spacers and methods of assembling the...
- Patent number 12,196,780
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Cheng Hsu
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of cracks in passivation layer
- Patent number 12,087,714
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for MRAM devices
- Patent number 12,063,790
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,021,144
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsien Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with epitaxial features having adjusted p...
- Patent number 11,862,519
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsien Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a facet-free source/drain epitaxial structu...
- Patent number 11,600,728
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsien Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feeding device with quantitative mechanism
- Patent number 11,570,967
- Issue date Feb 7, 2023
- Kinpo Electronics, Inc.
- Wen-Kai Tu
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Source and drain epitaxial layers
- Patent number 11,502,197
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsien Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,222,980
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsien Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage mode signal transceiving device and voltage mode signal tra...
- Patent number 10,965,284
- Issue date Mar 30, 2021
- Global Unichip Corporation
- Ting-Hsu Chien
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-channel transmission device
- Patent number 10,892,794
- Issue date Jan 12, 2021
- Global Unichip Corporation
- Yen-Chung T. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Driver device
- Patent number 10,749,526
- Issue date Aug 18, 2020
- Global Unichip Corporation
- Po-Shing Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat sink fastener
- Patent number 9,414,481
- Issue date Aug 9, 2016
- COOLER MASTER TECHNOLOGY INC.
- Wen-Ping Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for finFET devices
- Patent number 9,391,078
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CheeWee Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boost converter circuit
- Patent number 8,975,881
- Issue date Mar 10, 2015
- ASUSTeK COMPUTER Inc.
- Ming-Ting Tsai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of forming a tungsten-plug contact for a semiconductor device
- Patent number 6,020,259
- Issue date Feb 1, 2000
- Mosel Vitelic, Inc.
- Hsi-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR S...
- Publication number 20250218940
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CELL STRUCTURE
- Publication number 20250203838
- Publication date Jun 19, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- G11 - INFORMATION STORAGE
Information Patent Application
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE HAVING COMMON CONNECTION...
- Publication number 20250185262
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Structure with Stress-Release Pattern to Enhance Package Yield
- Publication number 20250118683
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE ASSEMBLY WITH MULTIPLE SPACERS AND METHODS OF ASSEMBLING THE...
- Publication number 20250102540
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Cheng HSU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE...
- Publication number 20250038105
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE WITH MULTIPLE VERTICAL THIN BODIES
- Publication number 20250015187
- Publication date Jan 9, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR CIRCUIT
- Publication number 20240413159
- Publication date Dec 12, 2024
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
- Publication number 20240395741
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387617
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MRAM DEVICES
- Publication number 20240365564
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240297254
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsien TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD NEEDLE SHAPE AND METHOD OF MANUFACTURING
- Publication number 20240151743
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu CHIU
- G01 - MEASURING TESTING
Information Patent Application
VIA WITH SACRIFICIAL STRESS BARRIER RING
- Publication number 20240145378
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures And Methods Of Forming The Same
- Publication number 20240113011
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240096710
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsien TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387192
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE PASSIVE DEVICE STRUCTURE
- Publication number 20230317593
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE STRUCTURE STRESS REDUCTION
- Publication number 20230317631
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE HAVING COMMON CONNECTION...
- Publication number 20230187479
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20230145953
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE AND DRAIN EPITAXIAL LAYERS
- Publication number 20230074496
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsien TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230068725
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsien TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for MRAM Devices
- Publication number 20230062842
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE ASSEMBLY WITH MULTIPLE SPACERS AND METHODS OF ASSEMBLING THE...
- Publication number 20230045361
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Cheng HSU
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PROBE PIN RETRIEVAL
- Publication number 20230034452
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHENG HSU
- G01 - MEASURING TESTING
Information Patent Application
SOURCE AND DRAIN EPITAXIAL LAYERS
- Publication number 20220376067
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsien TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDING DEVICE WITH QUANTITATIVE MECHANISM
- Publication number 20220322637
- Publication date Oct 13, 2022
- KINPO ELECTRONICS, INC.
- Wen-Kai TU
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING

Wen-Ping Tu

Person

Patents Grantslast 30 patents

Method for probe pin retrieval

Probe card needle shape and method of manufacturing

High voltage passive device structure

Back-end-of-line passive device structure having common connection...

Probe assembly with multiple spacers and methods of assembling the...

Reduction of cracks in passivation layer

Structure and method for MRAM devices

Method of manufacturing a semiconductor device and a semiconductor...

Integrated circuit device with epitaxial features having adjusted p...

Method of manufacturing a facet-free source/drain epitaxial structu...

Feeding device with quantitative mechanism

Source and drain epitaxial layers

Method of manufacturing a semiconductor device and a semiconductor...

Voltage mode signal transceiving device and voltage mode signal tra...

Multi-channel transmission device

Driver device

Heat sink fastener

Method and structure for finFET devices

Boost converter circuit

Method of forming a tungsten-plug contact for a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR S...

SEMICONDUCTOR CELL STRUCTURE

BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE HAVING COMMON CONNECTION...

SACRIFICIAL TEST PAD

IC Structure with Stress-Release Pattern to Enhance Package Yield

PROBE ASSEMBLY WITH MULTIPLE SPACERS AND METHODS OF ASSEMBLING THE...

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE...

TRANSISTOR STRUCTURE WITH MULTIPLE VERTICAL THIN BODIES

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR CIRCUIT

METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF

SEMICONDUCTOR DEVICE

REDUCTION OF CRACKS IN PASSIVATION LAYER

STRUCTURE AND METHOD FOR MRAM DEVICES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

PROBE CARD NEEDLE SHAPE AND METHOD OF MANUFACTURING

VIA WITH SACRIFICIAL STRESS BARRIER RING

Semiconductor Structures And Methods Of Forming The Same

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH VOLTAGE PASSIVE DEVICE STRUCTURE

PASSIVE DEVICE STRUCTURE STRESS REDUCTION

BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE HAVING COMMON CONNECTION...

REDUCTION OF CRACKS IN PASSIVATION LAYER

SOURCE AND DRAIN EPITAXIAL LAYERS

INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME

Structure and Method for MRAM Devices

PROBE ASSEMBLY WITH MULTIPLE SPACERS AND METHODS OF ASSEMBLING THE...

METHOD FOR PROBE PIN RETRIEVAL

SOURCE AND DRAIN EPITAXIAL LAYERS

FEEDING DEVICE WITH QUANTITATIVE MECHANISM