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Patents Grants
last 30 patents
Information
Patent Grant
Piezoelectric vibrating device capable of heat dissipation and cond...
Patent number
8,698,379
Issue date
Apr 15, 2014
Datron Products Co., Ltd.
Wen-Tong Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package with cooling arrangement
Patent number
6,567,270
Issue date
May 20, 2003
Orient Semiconductor Electronics Limited
Wen-Lo Shieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for making a metal bump with an increased height
Patent number
6,499,648
Issue date
Dec 31, 2002
Orient Semiconductor Electronics Limited
Wen-Lo Shieh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PIEZOELECTRIC VIBRATING DEVICE CAPABLE OF HEAT DISSIPATION AND COND...
Publication number
20120326567
Publication date
Dec 27, 2012
DATRON PRODUCTS CO., LTD
WEN-TONG LEU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor
Publication number
20030059721
Publication date
Mar 27, 2003
Wen-Lo Shieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip package with cooling arrangement
Publication number
20030035270
Publication date
Feb 20, 2003
Wen-Lo Shieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and device for making a metal bump with an increased height
Publication number
20030006268
Publication date
Jan 9, 2003
Wen-Lo Shieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT
Publication number
20020179686
Publication date
Dec 5, 2002
Wen-Lo Shieh
H01 - BASIC ELECTRIC ELEMENTS