Wen Yin

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising an integrated device with a back side metal layer
- Patent number 12,100,649
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed pad size and pad design
- Patent number 11,804,428
- Issue date Oct 31, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising wire bonds configured as a heat spreader
- Patent number 11,545,411
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Specialized surface mount device for symmetric heat distribution in...
- Patent number 11,189,575
- Issue date Nov 30, 2021
- QUALCOMM Incorporated
- Supatta Niramarnkarn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA MODULE HAVING ANTENNA IN MOLD LAYER, AND RELATED FABRICATIO...
- Publication number 20240396227
- Publication date Nov 28, 2024
- QUALCOMM Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE WITH A BACK SIDE METAL LAYER
- Publication number 20230091182
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Chien-Te FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS
- Publication number 20220270995
- Publication date Aug 25, 2022
- QUALCOMM Incorporated
- Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED PAD SIZE AND PAD DESIGN
- Publication number 20220157705
- Publication date May 19, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
- Publication number 20220037224
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPECIALIZED SURFACE MOUNT DEVICE FOR SYMMETRIC HEAT DISTRIBUTION IN...
- Publication number 20210358860
- Publication date Nov 18, 2021
- QUALCOMM Incorporated
- Supatta NIRAMARNKARN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC ELASTOMER (TPE) ADHESIVE CARRIER TAPE
- Publication number 20180166313
- Publication date Jun 14, 2018
- Intel Corporation
- Mingzhi Dai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package comprising an integrated device with a back side metal layer

Mixed pad size and pad design

Sidewall wetting barrier for conductive pillars

Package comprising wire bonds configured as a heat spreader

Specialized surface mount device for symmetric heat distribution in...

Patents Applicationslast 30 patents

ANTENNA MODULE HAVING ANTENNA IN MOLD LAYER, AND RELATED FABRICATIO...

PACKAGE COMPRISING AN INTEGRATED DEVICE WITH A BACK SIDE METAL LAYER

SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS

MIXED PAD SIZE AND PAD DESIGN

PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER

SPECIALIZED SURFACE MOUNT DEVICE FOR SYMMETRIC HEAT DISTRIBUTION IN...

THERMOPLASTIC ELASTOMER (TPE) ADHESIVE CARRIER TAPE