Wen-Yu Teng

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,542,598
- Issue date Jan 10, 2017
- Siliconware Precision Industries Co., Ltd.
- Wen-Yu Teng
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160172264
- Publication date Jun 16, 2016
- Siliconware Precision Industries Co., Ltd.
- Wen-Yu Teng
- G06 - COMPUTING CALCULATING COUNTING