Wen-Yuan Chang

Follow

Person

Taipie Hsien, TW

People

Patents Applicationslast 30 patents

Information Patent Application
Process for fabricating chip embedded package structure
- Publication number 20060105500
- Publication date May 18, 2006
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scanner carrier
- Publication number 20060039042
- Publication date Feb 23, 2006
- Wen-Yuan Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Chip embedded package structure
- Publication number 20050253244
- Publication date Nov 17, 2005
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scanner carrier
- Publication number 20030099003
- Publication date May 29, 2003
- Wen-Yuan Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Grid array package with increased electrical grounding routes and m...
- Publication number 20020093079
- Publication date Jul 18, 2002
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS