Wenbin Qu

Follow

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,901,260
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,444,001
- Issue date Sep 13, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming perforated opening in bottom substrate of flipchi...
- Patent number 9,105,647
- Issue date Aug 11, 2015
- STATS ChipPAC, Ltd.
- Junwei Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANNULAR STRUCTURE FOR AN ELECTRONIC FLAME OFF WAND
- Publication number 20250015040
- Publication date Jan 9, 2025
- Western Digital Technologies, Inc.
- Jingyun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
- Publication number 20220415750
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Perforated Opening in Bo...
- Publication number 20110278712
- Publication date Nov 17, 2011
- STATS ChipPAC, Ltd.
- Junwei Hu
- H01 - BASIC ELECTRIC ELEMENTS