Wenbin WANG

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Jiang Su, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package structure of light emitting diode and manufactu...
- Patent number 8,952,512
- Issue date Feb 10, 2015
- China Wafer Level CSP Ltd
- Junjie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure of light emitting diode and manufactu...
- Patent number 8,445,919
- Issue date May 21, 2013
- China Wafer Level CSP Ltd
- Junjie Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE FOR SEMICONDUCTOR CHIP
- Publication number 20200395399
- Publication date Dec 17, 2020
- China Water Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE FOR SEMICONDUCTOR CHIP
- Publication number 20190296064
- Publication date Sep 26, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND MANUFACTU...
- Publication number 20130228817
- Publication date Sep 5, 2013
- CHINA WAFER LEVEL CSP LTD.
- Junjie LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND MANUFACTU...
- Publication number 20110006322
- Publication date Jan 13, 2011
- CHINA WAFER LEVEL CSP LTD.
- Junjie LI
- H01 - BASIC ELECTRIC ELEMENTS