Wenbing Yang

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photoresist development with halide chemistries
- Patent number 12,105,422
- Issue date Oct 1, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Atomic layer etch and ion beam etch patterning
- Patent number 12,080,562
- Issue date Sep 3, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for subtractive metal etch
- Patent number 11,935,758
- Issue date Mar 19, 2024
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching and smoothing of refractory metals and other h...
- Patent number 11,450,513
- Issue date Sep 20, 2022
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High energy atomic layer etching
- Patent number 10,763,083
- Issue date Sep 1, 2020
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 10,749,103
- Issue date Aug 18, 2020
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching 3D structures: Si and SiGe and Ge smoothness o...
- Patent number 10,727,073
- Issue date Jul 28, 2020
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 10,515,816
- Issue date Dec 24, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 10,374,144
- Issue date Aug 6, 2019
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 10,186,426
- Issue date Jan 22, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten and other metals
- Patent number 10,096,487
- Issue date Oct 9, 2018
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of GaN and other III-V materials
- Patent number 10,056,264
- Issue date Aug 21, 2018
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten for enhanced tungsten deposition fill
- Patent number 9,972,504
- Issue date May 15, 2018
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 9,806,252
- Issue date Oct 31, 2017
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 9,805,941
- Issue date Oct 31, 2017
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 9,576,811
- Issue date Feb 21, 2017
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,391,267
- Issue date Jul 12, 2016
- Lam Research Corporation
- Meihua Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,257,638
- Issue date Feb 9, 2016
- Lam Research Corporation
- Samantha S.H. Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,130,158
- Issue date Sep 8, 2015
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20240419078
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20240361696
- Publication date Oct 31, 2024
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF CLEANING CHAMBER COMPONENTS WITH METAL ETCH RESIDUES
- Publication number 20240304428
- Publication date Sep 12, 2024
- LAM RESEARCH CORPORATION
- Wenbing YANG
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCHING
- Publication number 20240274408
- Publication date Aug 15, 2024
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH
- Publication number 20240186150
- Publication date Jun 6, 2024
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCH
- Publication number 20240021435
- Publication date Jan 18, 2024
- LAM RESEARCH CORPORATION
- Yiwen FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE COPPER ETCH
- Publication number 20230298869
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING A CHAMBER
- Publication number 20230230819
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Ran LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING AND SMOOTHING OF REFRACTORY METALS AND OTHER H...
- Publication number 20220392747
- Publication date Dec 8, 2022
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL ETCH NONVOLATILE MATERIALS FOR MRAM PATTERNING
- Publication number 20220376174
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH AND ION BEAM ETCH PATTERNING
- Publication number 20220254649
- Publication date Aug 11, 2022
- LAM RESEARCH CORPORATION
- Samantha SiamHwa TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20220244645
- Publication date Aug 4, 2022
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH
- Publication number 20220199422
- Publication date Jun 23, 2022
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20220115244
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20210305059
- Publication date Sep 30, 2021
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING AND SMOOTHING OF REFRACTORY METALS AND OTHER H...
- Publication number 20210005425
- Publication date Jan 7, 2021
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCHING
- Publication number 20200402770
- Publication date Dec 24, 2020
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20200286743
- Publication date Sep 10, 2020
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20200161139
- Publication date May 21, 2020
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20190312194
- Publication date Oct 10, 2019
- LAM RESEARCH CORPORATION
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20190139778
- Publication date May 9, 2019
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCHING
- Publication number 20190108982
- Publication date Apr 11, 2019
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20180240682
- Publication date Aug 23, 2018
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20180033635
- Publication date Feb 1, 2018
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20180019387
- Publication date Jan 18, 2018
- LAM RESEARCH CORPORATION
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING 3D STRUCTURES: SI AND SIGE AND GE SMOOTHNESS O...
- Publication number 20170229314
- Publication date Aug 10, 2017
- LAM RESEARCH CORPORATION
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20170117159
- Publication date Apr 27, 2017
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS
- Publication number 20170053810
- Publication date Feb 23, 2017
- LAM RESEARCH CORPORATION
- Wenbing Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20170040214
- Publication date Feb 9, 2017
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS
- Publication number 20160358782
- Publication date Dec 8, 2016
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS

Wenbing Yang

Person

Patents Grantslast 30 patents

Photoresist development with halide chemistries

Atomic layer etch and ion beam etch patterning

Atomic layer etching for subtractive metal etch

Atomic layer etching and smoothing of refractory metals and other h...

Atomic layer etch of tungsten for enhanced tungsten deposition fill

High energy atomic layer etching

Dry plasma etch method to pattern MRAM stack

Atomic layer etching 3D structures: Si and SiGe and Ge smoothness o...

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Atomic layer etching of tungsten and other metals

Atomic layer etching of GaN and other III-V materials

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Method to etch non-volatile metal materials

Method to etch non-volatile metal materials

Method to etch non-volatile metal materials

Patents Applicationslast 30 patents

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

METHOD OF CLEANING CHAMBER COMPONENTS WITH METAL ETCH RESIDUES

HIGH ENERGY ATOMIC LAYER ETCHING

ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH

METAL ETCH

SUBTRACTIVE COPPER ETCH

METHOD FOR CLEANING A CHAMBER

ATOMIC LAYER ETCHING AND SMOOTHING OF REFRACTORY METALS AND OTHER H...

CHEMICAL ETCH NONVOLATILE MATERIALS FOR MRAM PATTERNING

ATOMIC LAYER ETCH AND ION BEAM ETCH PATTERNING

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

ATOMIC LAYER ETCHING FOR SUBTRACTIVE METAL ETCH

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING AND SMOOTHING OF REFRACTORY METALS AND OTHER H...

HIGH ENERGY ATOMIC LAYER ETCHING

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

HIGH ENERGY ATOMIC LAYER ETCHING

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

ATOMIC LAYER ETCHING 3D STRUCTURES: SI AND SIGE AND GE SMOOTHNESS O...

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS