Wenbo Shao

Person

Milford, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and wet chemical compositions for diffusion barrier formation
- Patent number 12,157,944
- Issue date Dec 3, 2024
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and wet chemical compositions for diffusion barrier formation
- Patent number 11,846,018
- Issue date Dec 19, 2023
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,541,140
- Issue date Jan 21, 2020
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,103,029
- Issue date Oct 16, 2018
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Wet Chemical Compositions for Diffusion Barrier Formation
- Publication number 20230407467
- Publication date Dec 21, 2023
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Wet Chemical Compositions for Diffusion Barrier Formation
- Publication number 20220259724
- Publication date Aug 18, 2022
- MacDermid Enthone Inc.
- Richard W. Hurtubise
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Composition and Method for Fabrication of Nickel Interconnects
- Publication number 20220064811
- Publication date Mar 3, 2022
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Filling Vias in the Microelectronics
- Publication number 20160254156
- Publication date Sep 1, 2016
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
- Publication number 20140120722
- Publication date May 1, 2014
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Method and wet chemical compositions for diffusion barrier formation

Method and wet chemical compositions for diffusion barrier formation

Process for filling vias in the microelectronics

Copper filling of through silicon vias

Process for filling vias in the microelectronics

Patents Applicationslast 30 patents

Method and Wet Chemical Compositions for Diffusion Barrier Formation

Method and Wet Chemical Compositions for Diffusion Barrier Formation

Composition and Method for Fabrication of Nickel Interconnects

COPPER FILLING OF THROUGH SILICON VIAS

Process for Filling Vias in the Microelectronics

PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS

COPPER FILLING OF THROUGH SILICON VIAS