Wendy Eng

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Modified lead frame for improved parallelism of a die to package
- Patent number 6,239,480
- Issue date May 29, 2001
- Clear Logic, Inc.
- John MacPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving parallelism of a die to package using a modifie...
- Patent number 6,235,556
- Issue date May 22, 2001
- Clear Logic, Inc.
- John MacPherson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of improving parallelism of a die to package using a modifie...
- Publication number 20010000210
- Publication date Apr 12, 2001
- John MacPherson
- H01 - BASIC ELECTRIC ELEMENTS