Weng-Dah Ken

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-precision timing clock method
- Patent number 12,226,246
- Issue date Feb 18, 2025
- Weng-Dah Ken
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Non-contact angle measuring apparatus
- Patent number 11,903,755
- Issue date Feb 20, 2024
- Weng-Dah Ken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Green bike
- Patent number 10,604,203
- Issue date Mar 31, 2020
- Weng-Dah Ken
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System-in-package module with memory
- Patent number 10,504,603
- Issue date Dec 10, 2019
- Etron Technology, Inc.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reconfigurable high speed memory chip module and electronic device...
- Patent number 9,940,292
- Issue date Apr 10, 2018
- Etron Technology, Inc.
- Weng-Dah Ken
- G11 - INFORMATION STORAGE
Information Patent Grant
Reconfigurable high speed memory chip module and electronic device...
- Patent number 9,798,692
- Issue date Oct 24, 2017
- Etron Technology, Inc.
- Weng-Dah Ken
- G11 - INFORMATION STORAGE
Information Patent Grant
System-in-package module with memory
- Patent number 9,748,002
- Issue date Aug 29, 2017
- Etron Technology, Inc.
- Weng-Dah Ken
- G11 - INFORMATION STORAGE
Information Patent Grant
System-in-package module and manufacture method for a system-in-pac...
- Patent number 9,601,456
- Issue date Mar 21, 2017
- Etron Technology, Inc.
- Bor-Doou Rong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multi-project or multi-product wafer process
- Patent number 9,312,254
- Issue date Apr 12, 2016
- Weng-Dah Ken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigurable high speed memory chip module and electronic device...
- Patent number 9,201,834
- Issue date Dec 1, 2015
- Etron Technology, Inc.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed memory chip module and electronics system device with a...
- Patent number 9,164,942
- Issue date Oct 20, 2015
- Etron Technology, Inc.
- Weng-Dah Ken
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor multi-project or multi-product wafer process
- Patent number 9,140,978
- Issue date Sep 22, 2015
- Weng-Dah Ken
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
NON-INVASIVE MEASURING/DIAGNOSIS/TREATMENT APPARATUS AND METHOD
- Publication number 20250176925
- Publication date Jun 5, 2025
- Weng-Dah Ken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-PRECISION TIMING CLOCK METHOD AND APPARATUS
- Publication number 20240115222
- Publication date Apr 11, 2024
- Weng-Dah Ken
- G04 - HOROLOGY
Information Patent Application
NON-CONTACT ANGLE MEASURING APPARATUS
- Publication number 20200397391
- Publication date Dec 24, 2020
- Weng-Dah Ken
- G01 - MEASURING TESTING
Information Patent Application
TRANSISTOR WITH LOW LEAKAGE CURRENTS AND MANUFACTURING METHOD THEREOF
- Publication number 20200381548
- Publication date Dec 3, 2020
- ETRON TECHNOLOGY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE COMPUTING DEVICE RECONFIGURATION IS RESPONSE TO ENVIRONMENTA...
- Publication number 20180024959
- Publication date Jan 25, 2018
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM-IN-PACKAGE MODULE WITH MEMORY
- Publication number 20170323687
- Publication date Nov 9, 2017
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-CONTACT ANGLE MEASURING APPARATUS, MISSION CRITICAL INSPECTION...
- Publication number 20170281102
- Publication date Oct 5, 2017
- Weng-Dah Ken
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS
- Publication number 20160043065
- Publication date Feb 11, 2016
- Weng-Dah Ken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONIC DEVICE...
- Publication number 20150317276
- Publication date Nov 5, 2015
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM-IN-PACKAGE MODULE AND MANUFACTURE METHOD FOR A SYSTEM-IN-PAC...
- Publication number 20150206849
- Publication date Jul 23, 2015
- ETRON TECHNOLOGY, INC.
- Bor-Doou Rong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE MODULE WITH MEMORY
- Publication number 20150113356
- Publication date Apr 23, 2015
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH SPEED MEMORY CHIP MODULE AND ELECTRONICS SYSTEM DEVICE WITH A...
- Publication number 20130091315
- Publication date Apr 11, 2013
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONICS SYSTEM...
- Publication number 20130091312
- Publication date Apr 11, 2013
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS
- Publication number 20120088329
- Publication date Apr 12, 2012
- Weng-Dah Ken
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
GREEN BIKE
- Publication number 20120086183
- Publication date Apr 12, 2012
- Weng-Dah Ken
- B60 - VEHICLES IN GENERAL

Weng-Dah Ken

Person

Patents Grantslast 30 patents

Ultra-precision timing clock method

Non-contact angle measuring apparatus

Green bike

System-in-package module with memory

Reconfigurable high speed memory chip module and electronic device...

Reconfigurable high speed memory chip module and electronic device...

System-in-package module with memory

System-in-package module and manufacture method for a system-in-pac...

Semiconductor multi-project or multi-product wafer process

Reconfigurable high speed memory chip module and electronic device...

High speed memory chip module and electronics system device with a...

Semiconductor multi-project or multi-product wafer process

Patents Applicationslast 30 patents

NON-INVASIVE MEASURING/DIAGNOSIS/TREATMENT APPARATUS AND METHOD

ULTRA-PRECISION TIMING CLOCK METHOD AND APPARATUS

NON-CONTACT ANGLE MEASURING APPARATUS

TRANSISTOR WITH LOW LEAKAGE CURRENTS AND MANUFACTURING METHOD THEREOF

MOBILE COMPUTING DEVICE RECONFIGURATION IS RESPONSE TO ENVIRONMENTA...

SYSTEM-IN-PACKAGE MODULE WITH MEMORY

NON-CONTACT ANGLE MEASURING APPARATUS, MISSION CRITICAL INSPECTION...

SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS

RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONIC DEVICE...

SYSTEM-IN-PACKAGE MODULE AND MANUFACTURE METHOD FOR A SYSTEM-IN-PAC...

SYSTEM-IN-PACKAGE MODULE WITH MEMORY

HIGH SPEED MEMORY CHIP MODULE AND ELECTRONICS SYSTEM DEVICE WITH A...

RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONICS SYSTEM...

SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS

GREEN BIKE