Weng-Jin Wu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Controllable gap height for an image sensor package
- Patent number 11,996,424
- Issue date May 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure for a sensor having a sealing layer
- Patent number 11,605,659
- Issue date Mar 14, 2023
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded image sensor chip scale packages and related methods
- Patent number 11,508,766
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controllable gap height for an image sensor package
- Patent number 11,289,522
- Issue date Mar 29, 2022
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded image sensor semiconductor packages and related methods
- Patent number 11,201,182
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, structure, and method of manufacturing a semiconductor subs...
- Patent number 11,004,832
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded image sensor chip scale packages and related methods
- Patent number 10,910,421
- Issue date Feb 2, 2021
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor flip chip package
- Patent number 10,903,255
- Issue date Jan 26, 2021
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure for a sensor having a sealing layer
- Patent number 10,868,061
- Issue date Dec 15, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded image sensor semiconductor packages and related methods
- Patent number 10,707,250
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded image sensor semiconductor packages and related methods
- Patent number 10,615,202
- Issue date Apr 7, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, structure, and method of manufacturing a semiconductor subs...
- Patent number 10,515,933
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor package
- Patent number 10,418,396
- Issue date Sep 17, 2019
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 10,290,672
- Issue date May 14, 2019
- Semiconductor Components Industries, L.L.C.
- Larry Kinsman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded image sensor semiconductor packages and related methods
- Patent number 10,128,289
- Issue date Nov 13, 2018
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection layer for adhesive material at wafer edge
- Patent number 9,997,440
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method including adjusting surface contours of a bonding sy...
- Patent number 9,978,628
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded image sensor chip scale packages and related methods
- Patent number 9,960,197
- Issue date May 1, 2018
- Semiconductor Components Industries, LLC
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside through vias in a bonded structure
- Patent number 9,799,694
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Formation of through via before contact processing
- Patent number 9,793,192
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, structure, and method of manufacturing a semiconductor subs...
- Patent number 9,728,457
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with contamination barrier structures
- Patent number 9,515,108
- Issue date Dec 6, 2016
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Alignment mark and method of formation
- Patent number 9,478,480
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of substrate to substrate bonding for three di...
- Patent number 9,418,961
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of three dimensional integrated circuit assembly
- Patent number 9,418,876
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structures and methods of forming stacked structures
- Patent number 9,299,612
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding system and method of modifying the same
- Patent number 9,299,594
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside through vias in a bonded structure
- Patent number 9,293,418
- Issue date Mar 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Barrier for through-silicon via
- Patent number 9,287,166
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BLACK MASK ON GLASS SYSTEMS AND RELATED METHODS
- Publication number 20240120355
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gregg BARDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
- Publication number 20240030265
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLABLE GAP HEIGHT FOR AN IMAGE SENSOR PACKAGE
- Publication number 20220216256
- Publication date Jul 7, 2022
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS
- Publication number 20210151488
- Publication date May 20, 2021
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR FLIP CHIP PACKAGE
- Publication number 20210143199
- Publication date May 13, 2021
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR A SENSOR HAVING A SEALING LAYER
- Publication number 20210098518
- Publication date Apr 1, 2021
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLABLE GAP HEIGHT FOR AN IMAGE SENSOR PACKAGE
- Publication number 20200321375
- Publication date Oct 8, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20200295065
- Publication date Sep 17, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Flip Chip Package
- Publication number 20200152681
- Publication date May 14, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Structure, and Method of Manufacturing a Semiconductor Subs...
- Publication number 20200126953
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR A SENSOR HAVING A SEALING LAYER
- Publication number 20200052020
- Publication date Feb 13, 2020
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR PACKAGE
- Publication number 20190363122
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR PACKAGE
- Publication number 20190305023
- Publication date Oct 3, 2019
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190229144
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190043906
- Publication date Feb 7, 2019
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190043907
- Publication date Feb 7, 2019
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS
- Publication number 20180240828
- Publication date Aug 23, 2018
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20180076244
- Publication date Mar 15, 2018
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20170345864
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Structure, and Method of Manufacturing a Semiconductor Subs...
- Publication number 20170194295
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS WITH CONTAMINATION BARRIER STRUCTURES
- Publication number 20160268325
- Publication date Sep 15, 2016
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD INCLUDING ADJUSTING SURFACE CONTOURS OF A BONDING SY...
- Publication number 20160204014
- Publication date Jul 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Liang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Through Vias in a Bonded Structure
- Publication number 20160172403
- Publication date Jun 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Through Via Before Contact Processing
- Publication number 20160099196
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Mark and Method of Formation
- Publication number 20150069580
- Publication date Mar 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Structure, and Method of Manufacturing a Semiconductor Subs...
- Publication number 20150024546
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Through Vias in a Bonded Structure
- Publication number 20140232013
- Publication date Aug 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURES AND METHODS OF FORMING STACKED STRUCTURES
- Publication number 20140220741
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier for Through-Silicon Via
- Publication number 20140175652
- Publication date Jun 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method of Substrate to Substrate Bonding for Three Di...
- Publication number 20130320071
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Weng-Jin Wu

Person

Patents Grantslast 30 patents

Controllable gap height for an image sensor package

Packaging structure for a sensor having a sealing layer

Molded image sensor chip scale packages and related methods

Image sensor semiconductor packages and related methods

Controllable gap height for an image sensor package

Embedded image sensor semiconductor packages and related methods

System, structure, and method of manufacturing a semiconductor subs...

Molded image sensor chip scale packages and related methods

Image sensor flip chip package

Packaging structure for a sensor having a sealing layer

Embedded image sensor semiconductor packages and related methods

Embedded image sensor semiconductor packages and related methods

System, structure, and method of manufacturing a semiconductor subs...

Stacked image sensor package

Image sensor semiconductor packages and related methods

Embedded image sensor semiconductor packages and related methods

Protection layer for adhesive material at wafer edge

Bonding method including adjusting surface contours of a bonding sy...

Molded image sensor chip scale packages and related methods

Backside through vias in a bonded structure

Formation of through via before contact processing

System, structure, and method of manufacturing a semiconductor subs...

Image sensors with contamination barrier structures

Alignment mark and method of formation

Apparatus and method of substrate to substrate bonding for three di...

Method of three dimensional integrated circuit assembly

Stacked structures and methods of forming stacked structures

Substrate bonding system and method of modifying the same

Backside through vias in a bonded structure

Barrier for through-silicon via

Patents Applicationslast 30 patents

BLACK MASK ON GLASS SYSTEMS AND RELATED METHODS

STACKED CHIP SCALE OPTICAL SENSOR PACKAGE

CONTROLLABLE GAP HEIGHT FOR AN IMAGE SENSOR PACKAGE

MOLDED IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS

IMAGE SENSOR FLIP CHIP PACKAGE

PACKAGING STRUCTURE FOR A SENSOR HAVING A SEALING LAYER

CONTROLLABLE GAP HEIGHT FOR AN IMAGE SENSOR PACKAGE

EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

Image Sensor Flip Chip Package

System, Structure, and Method of Manufacturing a Semiconductor Subs...

PACKAGING STRUCTURE FOR A SENSOR HAVING A SEALING LAYER

STACKED IMAGE SENSOR PACKAGE

STACKED IMAGE SENSOR PACKAGE

IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

MOLDED IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS

EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

System, Structure, and Method of Manufacturing a Semiconductor Subs...

IMAGE SENSORS WITH CONTAMINATION BARRIER STRUCTURES

BONDING METHOD INCLUDING ADJUSTING SURFACE CONTOURS OF A BONDING SY...

Backside Through Vias in a Bonded Structure

Formation of Through Via Before Contact Processing

Alignment Mark and Method of Formation

System, Structure, and Method of Manufacturing a Semiconductor Subs...

Backside Through Vias in a Bonded Structure

STACKED STRUCTURES AND METHODS OF FORMING STACKED STRUCTURES

Barrier for Through-Silicon Via

Apparatus and Method of Substrate to Substrate Bonding for Three Di...