Weng Khoon Mong

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 9,397,016
- Issue date Jul 19, 2016
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,847,368
- Issue date Sep 30, 2014
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,258,019
- Issue date Sep 4, 2012
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlled fracture substrate singulation
- Patent number 7,172,951
- Issue date Feb 6, 2007
- Intel Corporation
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled fracture substrate singulation
- Patent number 7,005,317
- Issue date Feb 28, 2006
- Intel Corporation
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of thinning a wafer utilizing a laminated reinforcing layer...
- Patent number 6,713,366
- Issue date Mar 30, 2004
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240413032
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shaopeng Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...
- Publication number 20240407100
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20150076692
- Publication date Mar 19, 2015
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20120319276
- Publication date Dec 20, 2012
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20090321928
- Publication date Dec 31, 2009
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for controlled fracture substrate singulation
- Publication number 20060084241
- Publication date Apr 20, 2006
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Controlled fracture substrate singulation
- Publication number 20050101109
- Publication date May 12, 2005
- Oi Fong Chin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER...
- Publication number 20030235937
- Publication date Dec 25, 2003
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Weng Khoon Mong

Person

Patents Grantslast 30 patents

Flip chip assembly process for ultra thin substrate and package on...

Flip chip assembly process for ultra thin substrate and package on...

Flip chip assembly process for ultra thin substrate and package on...

Apparatus for controlled fracture substrate singulation

Controlled fracture substrate singulation

Method of thinning a wafer utilizing a laminated reinforcing layer...

Patents Applicationslast 30 patents

INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE

ELECTROLYTIC CAPACITORS HAVING ENCLOSURES THAT ENABLE THE CAPACITOR...

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

Apparatus for controlled fracture substrate singulation

Controlled fracture substrate singulation

METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER...