Weng Shyan Aik

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Tampin, MY

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package including die paddle with steps
- Patent number 7,982,293
- Issue date Jul 19, 2011
- Infineon Technologies AG
- Wei Kee Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-Chip Package
- Publication number 20090250797
- Publication date Oct 8, 2009
- INFINEON TECHNOLOGIES AG
- Wei Kee Chan
- H01 - BASIC ELECTRIC ELEMENTS