Wenhai He

Follow

Person

Tianshui, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Production method of high-density SIM card package
- Patent number 9,210,813
- Issue date Dec 8, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Jianyou Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-free land grid array IC chip package and preparation method...
- Patent number 9,136,231
- Issue date Sep 15, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Xiaowei Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER-FREE LAND GRID ARRAY IC CHIP PACKAGE AND PREPARATION METHOD...
- Publication number 20130334686
- Publication date Dec 19, 2013
- Tianshui Huatian Technology Co., Ltd.
- Xiaowei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20130223018
- Publication date Aug 29, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS