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Chandler, AZ, US
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last 30 patents
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Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
Publication number
20250079300
Publication date
Mar 6, 2025
Intel Corporation
Aleksandar ALEKSOV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
Publication number
20240063089
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240061194
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
G02 - OPTICS
Information
Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063066
Publication date
Feb 22, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
Publication number
20240063091
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
Publication number
20240063142
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
Publication number
20240063143
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
Publication number
20230317676
Publication date
Oct 5, 2023
Intel Corporation
Michael Baker
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES
Publication number
20230317630
Publication date
Oct 5, 2023
Intel Corporation
Wenhao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
Publication number
20230317675
Publication date
Oct 5, 2023
Intel Corporation
Michael Baker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
Publication number
20230317545
Publication date
Oct 5, 2023
Intel Corporation
Pilin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
Publication number
20230317549
Publication date
Oct 5, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
Publication number
20230317660
Publication date
Oct 5, 2023
Intel Corporation
Zhaozhi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...
Publication number
20230285999
Publication date
Sep 14, 2023
Intel Corporation
Wenhao Li
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...
Publication number
20230282542
Publication date
Sep 7, 2023
Intel Corporation
Wenhao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT...
Publication number
20230282543
Publication date
Sep 7, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES
Publication number
20230271445
Publication date
Aug 31, 2023
Intel Corporation
Feras Eid
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
Publication number
20230099827
Publication date
Mar 30, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
Publication number
20230098710
Publication date
Mar 30, 2023
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
Publication number
20230098303
Publication date
Mar 30, 2023
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS