Wenhao Li

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240061194
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- G02 - OPTICS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
- Publication number 20240063142
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
- Publication number 20240063143
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES
- Publication number 20230317630
- Publication date Oct 5, 2023
- Intel Corporation
- Wenhao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
- Publication number 20230317675
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
- Publication number 20230317549
- Publication date Oct 5, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES
- Publication number 20230317660
- Publication date Oct 5, 2023
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...
- Publication number 20230285999
- Publication date Sep 14, 2023
- Intel Corporation
- Wenhao Li
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...
- Publication number 20230282542
- Publication date Sep 7, 2023
- Intel Corporation
- Wenhao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT...
- Publication number 20230282543
- Publication date Sep 7, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES
- Publication number 20230271445
- Publication date Aug 31, 2023
- Intel Corporation
- Feras Eid
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230099827
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230098710
- Publication date Mar 30, 2023
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230098303
- Publication date Mar 30, 2023
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES

DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

PACKAGE STRUCTURES WITH COLLAPSE CONTROL FEATURES

NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...

PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES

DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...

METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...

METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT...

REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...