Wenjun TIAN

Person

Kunshan City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, copper clad laminate and printed circuit board u...
- Patent number 10,072,148
- Issue date Sep 11, 2018
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Rongtao Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, copper clad laminate and printed circuit board u...
- Patent number 9,850,375
- Issue date Dec 26, 2017
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD.
- Rongtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free resin composition, copper clad laminate using the same...
- Patent number 9,650,512
- Issue date May 16, 2017
- Elite Electronic Material (Kunshan) Co., Ltd
- Rong-Tao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aromatic tetrafunctional vinylbenzyl resin composition and use thereof
- Patent number 9,574,070
- Issue date Feb 21, 2017
- Elite Electronic Material (Kunshan) Co., Ltd.
- Rongtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dissipation factor resin composition and product made thereby
- Patent number 9,469,757
- Issue date Oct 18, 2016
- Elite Electronic Material (Kunshan) Co., Ltd.
- Rongtao Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyphenylene oxide resin, method of preparing polyphenylene oxide...
- Patent number 9,447,238
- Issue date Sep 20, 2016
- Elite Electronic Material (Kunshan) Co., Ltd.
- Yu Gao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low-dielectric resin composition and copper-clad laminate and print...
- Patent number 9,402,310
- Issue date Jul 26, 2016
- Elite Electronic Material (Kunshan) Co., Ltd.
- Rongtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lowdielectric resin composition, copper clad laminate using the sam...
- Patent number 9,131,607
- Issue date Sep 8, 2015
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Rong-Tao Wang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD U...
- Publication number 20180072884
- Publication date Mar 15, 2018
- Elite Electronic Material (kunShan) Co., Ltd.
- Rongtao WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD U...
- Publication number 20160222204
- Publication date Aug 4, 2016
- Rongtao WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYPHENYLENE OXIDE RESIN, METHOD OF PREPARING POLYPHENYLENE OXIDE...
- Publication number 20160185904
- Publication date Jun 30, 2016
- Elite Electronic Material (kunShan) Co., Ltd.
- Yu GAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AROMATIC TETRAFUNCTIONAL VINYLBENZYL RESIN COMPOSITION AND USE THEREOF
- Publication number 20160160008
- Publication date Jun 9, 2016
- Elite Electronic Material (kunShan) Co., Ltd.
- Rongtao WANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DISSIPATION FACTOR RESIN COMPOSITION AND PRODUCT MADE THEREBY
- Publication number 20160122521
- Publication date May 5, 2016
- Elite Electronic Material (kunShan) Co., Ltd.
- Rongtao WANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW-DIELECTRIC RESIN COMPOSITION AND COPPER-CLAD LAMINATE AND PRINT...
- Publication number 20150044485
- Publication date Feb 12, 2015
- Elite Electronic Material (kunShan) Co., Ltd.
- Rongtao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...
- Publication number 20140322541
- Publication date Oct 30, 2014
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- RONG-TAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOWDIELECTRIC RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAM...
- Publication number 20140174802
- Publication date Jun 26, 2014
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- RONG-TAO WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20140113118
- Publication date Apr 24, 2014
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- RONG-TAO WANG
- B32 - LAYERED PRODUCTS

Wenjun TIAN

Person

Patents Grantslast 30 patents

Resin composition, copper clad laminate and printed circuit board u...

Resin composition, copper clad laminate and printed circuit board u...

Halogen-free resin composition, copper clad laminate using the same...

Aromatic tetrafunctional vinylbenzyl resin composition and use thereof

Low dissipation factor resin composition and product made thereby

Polyphenylene oxide resin, method of preparing polyphenylene oxide...

Low-dielectric resin composition and copper-clad laminate and print...

Lowdielectric resin composition, copper clad laminate using the sam...

Patents Applicationslast 30 patents

RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD U...

RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD U...

POLYPHENYLENE OXIDE RESIN, METHOD OF PREPARING POLYPHENYLENE OXIDE...

AROMATIC TETRAFUNCTIONAL VINYLBENZYL RESIN COMPOSITION AND USE THEREOF

LOW DISSIPATION FACTOR RESIN COMPOSITION AND PRODUCT MADE THEREBY

LOW-DIELECTRIC RESIN COMPOSITION AND COPPER-CLAD LAMINATE AND PRINT...

HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME...

LOWDIELECTRIC RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAM...

HALOGEN-FREE RESIN COMPOSITION AND APPLICATION THEREOF