Wenkang Huang

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East Greenwich, RI, US

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Patents Grantslast 30 patents

Information Patent Grant
Coupled inductor paths with enhanced thermal dissipation
- Patent number 12,243,673
- Issue date Mar 4, 2025
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COUPLED INDUCTOR PATHS WITH ENHANCED THERMAL DISSIPATION
- Publication number 20230420173
- Publication date Dec 28, 2023
- Infineon Technologies Austrai AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Thermally Coupled to Passive Element
- Publication number 20230369160
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Device Power Module Arrangement
- Publication number 20230369256
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS