Wenqi Zhang

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing contact areas on a semiconductor substrate
- Patent number 10,332,850
- Issue date Jun 25, 2019
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for self-assembly of substrates and devices obtained thereof
- Patent number 9,000,588
- Issue date Apr 7, 2015
- IMEC
- Philippe Soussan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for material bonding
- Patent number 8,536,047
- Issue date Sep 17, 2013
- IMEC
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing Contact Areas on a Semiconductor Substrate
- Publication number 20140374919
- Publication date Dec 25, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Self-Assembly of Substrates and Devices Obtained Thereof
- Publication number 20140054771
- Publication date Feb 27, 2014
- IMEC
- Philippe Soussan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Isolation Trenches in Micro-Bump Interconnect St...
- Publication number 20130154112
- Publication date Jun 20, 2013
- Katholieke Universiteit Leuven, K.U.Leuven R&D
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MATERIAL BONDING
- Publication number 20110233792
- Publication date Sep 29, 2011
- IMEC
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS