Wensen Hung

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener structure and method forming t...
- Patent number 12,125,757
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,074,154
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 12,021,006
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lid structure
- Patent number 11,929,293
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,810,833
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener structure
- Patent number 11,721,602
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,715,675
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,594,469
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Chang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,587,845
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,302,600
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,282,825
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,282,766
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company
- Shih-Chang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package comprising perforated foil sheet
- Patent number 11,257,690
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 11,133,237
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,088,048
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,062,971
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 11,018,073
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling devices, packaged semiconductor devices, and methods of pac...
- Patent number 11,004,771
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device methods of manufacture
- Patent number 10,978,373
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,884
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,885
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package comprising perforated foil sheet
- Patent number 10,685,854
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 10,629,510
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,515,867
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods for semiconductor devices
- Patent number 10,510,687
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,483,187
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240387307
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHODS THEREOF
- Publication number 20240387315
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363611
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240234223
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages, Devices Using the Same, and Methods of...
- Publication number 20240105530
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240088093
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038617
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE
- Publication number 20240030084
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
- Publication number 20230386945
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20230369162
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD FORMING T...
- Publication number 20230335449
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230326826
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20230144244
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS, SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURIN...
- Publication number 20230075909
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHODS THEREOF
- Publication number 20230071418
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230071542
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230059983
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FORMING THE SAME
- Publication number 20220359322
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220189844
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220149030
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220102288
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210366889
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210366805
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HSI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20210343619
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20210287956
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreading Device and Method
- Publication number 20210280491
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Wensen Hung

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Semiconductor package with stiffener structure and method forming t...

Semiconductor device having heat dissipation structure of curved pr...

Package structure

Package structure and method and equipment for forming the same

3DIC packaging with hot spot thermal management features

Semiconductor package with lid structure

Package structure and method and equipment for forming the same

Semiconductor package with stiffener structure

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacture

Semiconductor structure

Semiconductor device and manufacturing method thereof

Package structure

Package structure

3DIC package comprising perforated foil sheet

Package with embedded heat dissipation features

Semiconductor structure

Package structure and method and equipment for forming the same

3DIC packaging with hot spot thermal management features

Heat spreading device and method

Cooling devices, packaged semiconductor devices, and methods of pac...

Semiconductor device methods of manufacture

Heat spreading device and method

Heat spreading device and method

3DIC package comprising perforated foil sheet

Package with embedded heat dissipation features

Semiconductor structure and manufacturing method thereof

Packaging devices and methods for semiconductor devices

Heat spreading device and method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Packages, Devices Using the Same, and Methods of...

Integrated Circuit Packages and Methods of Forming the Same

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR PACKAGE

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...

Package Structure and Method and Equipment for Forming the Same

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD FORMING T...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Manufacture

ELECTRONIC APPARATUS, SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURIN...

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND METHOD FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

Package Structure and Method and Equipment for Forming the Same

3DIC Packaging with Hot Spot Thermal Management Features

Heat Spreading Device and Method