Wensen Li

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Etching process to selectively remove copper plating seed layer
- Patent number 6,767,477
- Issue date Jul 27, 2004
- Headway Technologies, Inc.
- Xue Hua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching process to selectively remove copper plating seed layer
- Patent number 6,428,719
- Issue date Aug 6, 2002
- Headway Technologies, Inc.
- Xuehua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Etching process to selectively remove copper plating seed layer
- Publication number 20020168223
- Publication date Nov 14, 2002
- HEADWAY TECHNOLOGIES, INC.
- Xue Hua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...