Wenshi Wang

Person

Zhuhai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit prearranged heat dissipation embedded packaging structure a...
- Patent number 12,002,734
- Issue date Jun 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with antenna and manufacturing method thereof
- Patent number 11,984,414
- Issue date May 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structure, manufacturing method thereof and substrate
- Patent number 11,942,465
- Issue date Mar 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity substrate having directional optoelectronic transmission cha...
- Patent number 11,822,121
- Issue date Nov 21, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- G02 - OPTICS
Information Patent Grant
Cavity substrate having directional optoelectronic transmission cha...
- Patent number 11,579,362
- Issue date Feb 14, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- G02 - OPTICS
Information Patent Grant
Support frame structure and manufacturing method thereof
- Patent number 11,569,177
- Issue date Jan 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging structure having shielding cavity and manufactur...
- Patent number 11,450,619
- Issue date Sep 20, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging method capable of realizing heat dissipation
- Patent number 11,114,310
- Issue date Sep 7, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY SUBSTRATE HAVING DIRECTIONAL OPTOELECTRONIC TRANSMISSION CHA...
- Publication number 20230161103
- Publication date May 25, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- G02 - OPTICS
Information Patent Application
SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230154859
- Publication date May 18, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230145610
- Publication date May 11, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...
- Publication number 20220392862
- Publication date Dec 8, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302037
- Publication date Sep 22, 2022
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR-INTEGRATING EMBEDDED SUPPORT FRAME AND SUBSTRATE, AND MANU...
- Publication number 20220285088
- Publication date Sep 8, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE WITH ANTENNA AND MANUFACTURING METHOD THEREOF
- Publication number 20220254741
- Publication date Aug 11, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY SUBSTRATE HAVING DIRECTIONAL OPTOELECTRONIC TRANSMISSION CHA...
- Publication number 20220066096
- Publication date Mar 3, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- G02 - OPTICS
Information Patent Application
CIRCUIT PREARRANGED HEAT DISSIPATION EMBEDDED PACKAGING STRUCTURE A...
- Publication number 20220068760
- Publication date Mar 3, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRUCTURE, MANUFACTURING METHOD THEREOF AND SUBSTRATE
- Publication number 20220059520
- Publication date Feb 24, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING STRUCTURE HAVING SHIELDING CAVITY AND MANUFACTUR...
- Publication number 20220045014
- Publication date Feb 10, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210407921
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Wenshi Wang

Person

Patents Grantslast 30 patents

Embedded chip package and manufacturing method thereof

Circuit prearranged heat dissipation embedded packaging structure a...

Packaging structure with antenna and manufacturing method thereof

Embedded structure, manufacturing method thereof and substrate

Embedded chip package and manufacturing method thereof

Cavity substrate having directional optoelectronic transmission cha...

Cavity substrate having directional optoelectronic transmission cha...

Support frame structure and manufacturing method thereof

Embedded packaging structure having shielding cavity and manufactur...

Embedded packaging method capable of realizing heat dissipation

Patents Applicationslast 30 patents

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE MANUFACTURING METHOD

CAVITY SUBSTRATE HAVING DIRECTIONAL OPTOELECTRONIC TRANSMISSION CHA...

SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...

EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

INDUCTOR-INTEGRATING EMBEDDED SUPPORT FRAME AND SUBSTRATE, AND MANU...

PACKAGING STRUCTURE WITH ANTENNA AND MANUFACTURING METHOD THEREOF

CAVITY SUBSTRATE HAVING DIRECTIONAL OPTOELECTRONIC TRANSMISSION CHA...

CIRCUIT PREARRANGED HEAT DISSIPATION EMBEDDED PACKAGING STRUCTURE A...

EMBEDDED STRUCTURE, MANUFACTURING METHOD THEREOF AND SUBSTRATE

EMBEDDED PACKAGING STRUCTURE HAVING SHIELDING CAVITY AND MANUFACTUR...

SUPPORT FRAME STRUCTURE AND MANUFACTURING METHOD THEREOF