TREA

Wenyue Zhang

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  • San Jose, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device thermal bump
    • Patent number 11,621,209
    • Issue date Apr 4, 2023
    • QUALCOMM Incorporated
    • Lei Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Microelectromechanical system (MEMS) bond release structure and met...
    • Patent number 9,922,956
    • Issue date Mar 20, 2018
    • QUALCOMM Incorporated
    • Je-Hsiung Jeffrey Lan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    MEMS varactors
    • Patent number 8,922,974
    • Issue date Dec 30, 2014
    • QUALCOMM Incorporated
    • Je-Hsiung Lan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    MEMS varactors
    • Patent number 8,363,380
    • Issue date Jan 29, 2013
    • QUALCOMM Incorporated
    • Je-Hsiung Lan
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents