Werner Kroeninger

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Device for treating wafers on assembly carriers
- Patent number 8,753,176
- Issue date Jun 17, 2014
- Infineon Technologies AG
- Werner Kroeninger
- B24 - GRINDING POLISHING
Information Patent Grant
Method for applying a resist layer, uses of adhesive materials, and...
- Patent number 8,415,080
- Issue date Apr 9, 2013
- Infineon Technologies AG
- Werner Kroeninger
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and method
- Patent number 8,017,942
- Issue date Sep 13, 2011
- Infineon Technologies AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a resist layer, uses of adhesive materials, and...
- Patent number 8,003,292
- Issue date Aug 23, 2011
- Infineon Technologies AG
- Werner Kroeninger
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacturing a semiconductor device including etching to...
- Patent number 7,923,350
- Issue date Apr 12, 2011
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for treating wafers on assembly carriers
- Patent number 7,918,714
- Issue date Apr 5, 2011
- Infineon Technologies AG
- Werner Kroeninger
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing a thin semiconductor chip
- Patent number 7,863,104
- Issue date Jan 4, 2011
- Infineon Technologies AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of integrated circuit fabrication
- Patent number 7,824,962
- Issue date Nov 2, 2010
- Infineon Technologies AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,759,163
- Issue date Jul 20, 2010
- Infineon Technologies AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing thin integrated semiconductor devices
- Patent number 7,674,654
- Issue date Mar 9, 2010
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing electronic devices
- Patent number 7,582,513
- Issue date Sep 1, 2009
- Infineon Technologies AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device for Treating Wafers on Assembly Carriers
- Publication number 20110146567
- Publication date Jun 23, 2011
- Werner Kroeninger
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20100127355
- Publication date May 27, 2010
- INFINEON TECHNOLOGIES AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING ETCHING TO...
- Publication number 20100059864
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20090261468
- Publication date Oct 22, 2009
- INFINEON TECHNOLOGIES AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTEGRATED CIRCUIT FABRICATION
- Publication number 20090189258
- Publication date Jul 30, 2009
- INFINEON TECHNOLOGIES AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a Thin Semiconductor Chip
- Publication number 20090098684
- Publication date Apr 16, 2009
- INFINEON TECHNOLOGIES AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method for producing electronic devices
- Publication number 20080224316
- Publication date Sep 18, 2008
- INFINEON TECHNOLOGIES AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Treating Wafers on Assembly Carriers
- Publication number 20080057834
- Publication date Mar 6, 2008
- Werner Kroeninger
- B24 - GRINDING POLISHING
Information Patent Application
DEVICE AND METHOD FOR THE PROCESSING OF WAFERS
- Publication number 20080014715
- Publication date Jan 17, 2008
- INFINEON TECHNOLOGIES AG
- Hans Leitner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Producing Thin Integrated Semiconductor Devices
- Publication number 20070278653
- Publication date Dec 6, 2007
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS

Werner Kroeninger

Person

Patents Grantslast 30 patents

Device for treating wafers on assembly carriers

Method for applying a resist layer, uses of adhesive materials, and...

Semiconductor device and method

Method for applying a resist layer, uses of adhesive materials, and...

Method of manufacturing a semiconductor device including etching to...

Methods for treating wafers on assembly carriers

Method of producing a thin semiconductor chip

Method of integrated circuit fabrication

Semiconductor module

Producing thin integrated semiconductor devices

Electronic device and method for producing electronic devices

Patents Applicationslast 30 patents

Device for Treating Wafers on Assembly Carriers

SEMICONDUCTOR DEVICE AND METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING ETCHING TO...

SEMICONDUCTOR MODULE

METHOD OF INTEGRATED CIRCUIT FABRICATION

Method of Producing a Thin Semiconductor Chip

Electronic device and method for producing electronic devices

Method and Device for Treating Wafers on Assembly Carriers

DEVICE AND METHOD FOR THE PROCESSING OF WAFERS

Producing Thin Integrated Semiconductor Devices